| Summary: | Three-dimensional (3D) spintronic devices are attracting significant research interest due to their potential for both fundamental studies and computing applications. However, their implementations face great challenges regarding not only the fabrication of 3D nanomagnets with high quality materials, but also their integration into 2D microelectronic circuits. In this study, we developed a new fabrication process to facilitate the efficient integration of both non-planar 3D geometries and high-quality multi-layered magnetic materials to prototype 3D spintronic devices, as a first step to investigate new physical effects in such systems. Specifically, we exploited 3D nanoprinting, physical vapour deposition and lithographic techniques to realise a 3D nanomagnetic circuit based on a nanobridge geometry, coated with high quality Ta/CoFeB/Ta layers. The successful establishment of this 3D circuit was verified through magnetotransport measurements in combination with micromagnetic simulations and finite element modelling. This fabrication process provides new capabilities for the realisation of a greater variety of 3D nanomagnetic circuits, which will facilitate the understanding and exploitation of 3D spintronic systems.
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