Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists
A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2009-08-01
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| Series: | Sensors |
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| Online Access: | http://www.mdpi.com/1424-8220/9/8/6200/ |
| _version_ | 1798006548533870592 |
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| author | Wood-Hi Cheng Lung-Tai Chen Jin-Sheng Chang Chung-Yi Hsu |
| author_facet | Wood-Hi Cheng Lung-Tai Chen Jin-Sheng Chang Chung-Yi Hsu |
| author_sort | Wood-Hi Cheng |
| collection | DOAJ |
| description | A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure sensors were investigated by using a finite-element (FE) model and experimental measurements. The results show that the thermal signal drift of the packaged pressure sensor with a small sensing-channel opening or with a thin silicon membrane for the dam-ring approach had a high packaging induced thermal stress, leading to a high temperature coefficient of span (TCO) response of -0.19% span/°C. The results also show that the thermal signal drift of the packaged pressure sensors with a large sensing-channel opening for sacrifice-replacement approach significantly reduced packaging induced thermal stress, and hence a low TCO response of -0.065% span/°C. However, the packaged pressure sensors of both the sacrifice-replacement and dam-ring type still met the specification -0.2% span/°C of the unpackaged pressure sensor. In addition, the size of proposed packages was 4 × 4 × 1.5 mm3 which was about seven times less than the commercialized packages. With the same packaging requirement, the proposed packaging approaches may provide an adequate solution for use in other open-cavity sensors, such as gas sensors, image sensors, and humidity sensors. |
| first_indexed | 2024-04-11T12:56:30Z |
| format | Article |
| id | doaj.art-dc3342bc097c4572a4d50f09118a94e1 |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-04-11T12:56:30Z |
| publishDate | 2009-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-dc3342bc097c4572a4d50f09118a94e12022-12-22T04:23:03ZengMDPI AGSensors1424-82202009-08-01986200621810.3390/s90806200Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick PhotoresistsWood-Hi ChengLung-Tai ChenJin-Sheng ChangChung-Yi HsuA novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure sensors were investigated by using a finite-element (FE) model and experimental measurements. The results show that the thermal signal drift of the packaged pressure sensor with a small sensing-channel opening or with a thin silicon membrane for the dam-ring approach had a high packaging induced thermal stress, leading to a high temperature coefficient of span (TCO) response of -0.19% span/°C. The results also show that the thermal signal drift of the packaged pressure sensors with a large sensing-channel opening for sacrifice-replacement approach significantly reduced packaging induced thermal stress, and hence a low TCO response of -0.065% span/°C. However, the packaged pressure sensors of both the sacrifice-replacement and dam-ring type still met the specification -0.2% span/°C of the unpackaged pressure sensor. In addition, the size of proposed packages was 4 × 4 × 1.5 mm3 which was about seven times less than the commercialized packages. With the same packaging requirement, the proposed packaging approaches may provide an adequate solution for use in other open-cavity sensors, such as gas sensors, image sensors, and humidity sensors.http://www.mdpi.com/1424-8220/9/8/6200/pressure sensorphotoresistpackaging |
| spellingShingle | Wood-Hi Cheng Lung-Tai Chen Jin-Sheng Chang Chung-Yi Hsu Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists Sensors pressure sensor photoresist packaging |
| title | Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists |
| title_full | Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists |
| title_fullStr | Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists |
| title_full_unstemmed | Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists |
| title_short | Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists |
| title_sort | fabrication and performance of mems based pressure sensor packages using patterned ultra thick photoresists |
| topic | pressure sensor photoresist packaging |
| url | http://www.mdpi.com/1424-8220/9/8/6200/ |
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