Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates
Development and evaluation of electronics with printing techniques such as inkjet printing is currently an active subject of research with various outstanding results in sensing applications. Printing technologies have shown high efficiency and compatibility with various types of inks and substrates...
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Format: | Article |
Language: | English |
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Elsevier
2022-06-01
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Series: | Micro and Nano Engineering |
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Online Access: | http://www.sciencedirect.com/science/article/pii/S2590007222000260 |
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author | Apostolos Apostolakis Dimitris Barmpakos Aggelos Pilatis George Patsis Dimitrios-Nikolaos Pagonis Vassiliki Belessi Grigoris Kaltsas |
author_facet | Apostolos Apostolakis Dimitris Barmpakos Aggelos Pilatis George Patsis Dimitrios-Nikolaos Pagonis Vassiliki Belessi Grigoris Kaltsas |
author_sort | Apostolos Apostolakis |
collection | DOAJ |
description | Development and evaluation of electronics with printing techniques such as inkjet printing is currently an active subject of research with various outstanding results in sensing applications. Printing technologies have shown high efficiency and compatibility with various types of inks and substrates, enhancing the opportunity for scientific innovation and research in this field. The present work reports on the evaluation of the resistivity and the sheet resistance of inkjet-printed conductive commercial Ag-nanoparticle ink, graphene ink and a custom functionalized reduced graphene oxide (f-rGO) ink on Kapton substrate using the Van-der-Pauw method. Two different approximations have been used to determine the sheet resistance (Rs) and the corresponding resistivity (ρ). The results showed differences in the extracted sheet resistance value, which emphasizes the importance of the adopted calculation method. Furthermore, in order to demonstrate the ability to fabricate printed structures with efficient electrical connection to external devices, we have evaluated standard methods for interfacing two inkjet-printed materials on Kapton substrate, namely: commercial Ag-nanoparticle ink and graphene ink. Two standard connection techniques implementing a 4-pin Flexible Printed Circuit (FPC) connector and an Amphenol Clincher connector were evaluated, along with a custom direct interconnection approach. Direct interconnection between Cu patterned tracks and printed structures attracts special interest because it addresses one of the main problems in printed electronics, which is the interfacing of the printed structure with other electronic or read-out components. Thus, the printed Ag-Graphene/Cu direct interconnection case was further investigated. Two-point [2p] and four-point [4p] measurements were performed in order to study the effect of the various probe locations of engagement to the extracted resistance. The results acquired for this interconnection method revealed the importance of the measurement probe location. To support these experimental results, FEA simulations were performed and the outcomes were consistent with the experimental findings. |
first_indexed | 2024-04-13T22:53:25Z |
format | Article |
id | doaj.art-dc43502cb7434ee5a5c5f544c8336c46 |
institution | Directory Open Access Journal |
issn | 2590-0072 |
language | English |
last_indexed | 2024-04-13T22:53:25Z |
publishDate | 2022-06-01 |
publisher | Elsevier |
record_format | Article |
series | Micro and Nano Engineering |
spelling | doaj.art-dc43502cb7434ee5a5c5f544c8336c462022-12-22T02:26:06ZengElsevierMicro and Nano Engineering2590-00722022-06-0115100129Resistivity study of inkjet-printed structures and electrical interfacing on flexible substratesApostolos Apostolakis0Dimitris Barmpakos1Aggelos Pilatis2George Patsis3Dimitrios-Nikolaos Pagonis4Vassiliki Belessi5Grigoris Kaltsas6microSENSES Laboratory, Department of Electrical and Electronics Engineering, University of West Attica, Egaleo, 122 44, Athens, Greece; Corresponding author.microSENSES Laboratory, Department of Electrical and Electronics Engineering, University of West Attica, Egaleo, 122 44, Athens, GreecemicroSENSES Laboratory, Department of Electrical and Electronics Engineering, University of West Attica, Egaleo, 122 44, Athens, Greece; Department of Naval Architecture, University of West Attica, Egaleo, 122 44, Athens, GreecemicroSENSES Laboratory, Department of Electrical and Electronics Engineering, University of West Attica, Egaleo, 122 44, Athens, GreeceDepartment of Naval Architecture, University of West Attica, Egaleo, 122 44, Athens, GreeceDepartment of Graphic Design and Visual Communication, Graphic Arts Technology Study Direction, University of West Attica, Egaleo, 122 43, Athens, GreecemicroSENSES Laboratory, Department of Electrical and Electronics Engineering, University of West Attica, Egaleo, 122 44, Athens, GreeceDevelopment and evaluation of electronics with printing techniques such as inkjet printing is currently an active subject of research with various outstanding results in sensing applications. Printing technologies have shown high efficiency and compatibility with various types of inks and substrates, enhancing the opportunity for scientific innovation and research in this field. The present work reports on the evaluation of the resistivity and the sheet resistance of inkjet-printed conductive commercial Ag-nanoparticle ink, graphene ink and a custom functionalized reduced graphene oxide (f-rGO) ink on Kapton substrate using the Van-der-Pauw method. Two different approximations have been used to determine the sheet resistance (Rs) and the corresponding resistivity (ρ). The results showed differences in the extracted sheet resistance value, which emphasizes the importance of the adopted calculation method. Furthermore, in order to demonstrate the ability to fabricate printed structures with efficient electrical connection to external devices, we have evaluated standard methods for interfacing two inkjet-printed materials on Kapton substrate, namely: commercial Ag-nanoparticle ink and graphene ink. Two standard connection techniques implementing a 4-pin Flexible Printed Circuit (FPC) connector and an Amphenol Clincher connector were evaluated, along with a custom direct interconnection approach. Direct interconnection between Cu patterned tracks and printed structures attracts special interest because it addresses one of the main problems in printed electronics, which is the interfacing of the printed structure with other electronic or read-out components. Thus, the printed Ag-Graphene/Cu direct interconnection case was further investigated. Two-point [2p] and four-point [4p] measurements were performed in order to study the effect of the various probe locations of engagement to the extracted resistance. The results acquired for this interconnection method revealed the importance of the measurement probe location. To support these experimental results, FEA simulations were performed and the outcomes were consistent with the experimental findings.http://www.sciencedirect.com/science/article/pii/S2590007222000260Printed electronicsElectrical interfacingFlexible substratesVan-der-Pauw methodSheet resistance |
spellingShingle | Apostolos Apostolakis Dimitris Barmpakos Aggelos Pilatis George Patsis Dimitrios-Nikolaos Pagonis Vassiliki Belessi Grigoris Kaltsas Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates Micro and Nano Engineering Printed electronics Electrical interfacing Flexible substrates Van-der-Pauw method Sheet resistance |
title | Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates |
title_full | Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates |
title_fullStr | Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates |
title_full_unstemmed | Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates |
title_short | Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates |
title_sort | resistivity study of inkjet printed structures and electrical interfacing on flexible substrates |
topic | Printed electronics Electrical interfacing Flexible substrates Van-der-Pauw method Sheet resistance |
url | http://www.sciencedirect.com/science/article/pii/S2590007222000260 |
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