Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys

Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys

An experimental study has been carried out to evaluate the microstructural and microhardness evolution on the directionally solidified binary Al-Cu and multicomponent Al-Cu-Si alloys and the influence of Si alloying. For this purpose specimens of Al-6wt.%Cu and Al-6wt.%Cu-8wt.%Si alloys were prepare...

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Bibliographic Details
Main Authors:	ANGELA J. VASCONCELOS, RAFAEL H. KIKUCHI, ANDRÉ S. BARROS, THIAGO A. COSTA, MARCELINO DIAS, ANTONIO L. MOREIRA, ADRINA P. SILVA, OTÁVIO L. ROCHA
Format:	Article
Language:	English
Published:	Academia Brasileira de Ciências 2016-06-01
Series:	Anais da Academia Brasileira de Ciências
Subjects:	solidificação metais e ligas microscopia eletrônica dureza
Online Access:	http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0001-37652016000301099&lng=en&tlng=en

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