ANALYSIS OF THE THERMAL EFFECT OF TWO INTERNAL PARALLEL PRINTED CIRCUIT BOARD CONDUCTORS MOUNTED ON A METAL BASE AND LOCATED IN ONE LAYER
Background. An analysis is made of the thermal effect of two internal parallel printed circuit board conductors located in one layer, which are installed on a metal base (on top of each other) and operate in space vacuum conditions. The purpose of the work was to analyze the mutual influence of two...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Penza State University Publishing House
2023-10-01
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| Series: | Надежность и качество сложных систем |
| Subjects: |
| _version_ | 1797657763703160832 |
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| author | Aleksey V. Kostin Dmitriy S. Bogdanov Igor S. Bobrov |
| author_facet | Aleksey V. Kostin Dmitriy S. Bogdanov Igor S. Bobrov |
| author_sort | Aleksey V. Kostin |
| collection | DOAJ |
| description | Background. An analysis is made of the thermal effect of two internal parallel printed circuit board conductors located in one layer, which are installed on a metal base (on top of each other) and operate in space vacuum conditions. The purpose of the work was to analyze the mutual influence of two internal parallel PCBs located on the same layer, boards installed on a metal base and operating in space vacuum conditions, on each other, in order to identify the dependence of their temperature on the distance between them and determine the distance at which this dependency almost disappears. Materials and method. The results of calculating the temperature of printed conductors at different distances between them for different printed circuit boards are considered. All calculations were performed numerically, implemented in the ANSYS 2021 R1 program, Steady-State Thermal module. The results of approximation of the obtained data are given. The distances between the printed conductors are given, at which their mutual influence almost completely disappears. Conclusions. The conductive pattern of the board is quite complex. PPs located on different
layers and running at an angle relative to each other can also interact with each other. The simulation of the thermal process has been carried out, the theoretical calculation and the construction of graphs have been made, which will help in the practical design of the printed circuit board. |
| first_indexed | 2024-03-11T17:49:27Z |
| format | Article |
| id | doaj.art-dcc16e3a1c3e4afeb61cc6d11ed21222 |
| institution | Directory Open Access Journal |
| issn | 2307-4205 |
| language | English |
| last_indexed | 2024-03-11T17:49:27Z |
| publishDate | 2023-10-01 |
| publisher | Penza State University Publishing House |
| record_format | Article |
| series | Надежность и качество сложных систем |
| spelling | doaj.art-dcc16e3a1c3e4afeb61cc6d11ed212222023-10-18T07:03:01ZengPenza State University Publishing HouseНадежность и качество сложных систем2307-42052023-10-013doi:10.21685/2307-4205-2023-3-11ANALYSIS OF THE THERMAL EFFECT OF TWO INTERNAL PARALLEL PRINTED CIRCUIT BOARD CONDUCTORS MOUNTED ON A METAL BASE AND LOCATED IN ONE LAYER Aleksey V. Kostin0Dmitriy S. Bogdanov1Igor S. Bobrov2 Samara National Research University named after Academician S.P. KorolevSamara National Research University named after Academician S.P. Korolev Samara National Research University named after Academician S.P. KorolevBackground. An analysis is made of the thermal effect of two internal parallel printed circuit board conductors located in one layer, which are installed on a metal base (on top of each other) and operate in space vacuum conditions. The purpose of the work was to analyze the mutual influence of two internal parallel PCBs located on the same layer, boards installed on a metal base and operating in space vacuum conditions, on each other, in order to identify the dependence of their temperature on the distance between them and determine the distance at which this dependency almost disappears. Materials and method. The results of calculating the temperature of printed conductors at different distances between them for different printed circuit boards are considered. All calculations were performed numerically, implemented in the ANSYS 2021 R1 program, Steady-State Thermal module. The results of approximation of the obtained data are given. The distances between the printed conductors are given, at which their mutual influence almost completely disappears. Conclusions. The conductive pattern of the board is quite complex. PPs located on different layers and running at an angle relative to each other can also interact with each other. The simulation of the thermal process has been carried out, the theoretical calculation and the construction of graphs have been made, which will help in the practical design of the printed circuit board. printed conductorprinted circuit boardapproximationthermal processmetal base |
| spellingShingle | Aleksey V. Kostin Dmitriy S. Bogdanov Igor S. Bobrov ANALYSIS OF THE THERMAL EFFECT OF TWO INTERNAL PARALLEL PRINTED CIRCUIT BOARD CONDUCTORS MOUNTED ON A METAL BASE AND LOCATED IN ONE LAYER Надежность и качество сложных систем printed conductor printed circuit board approximation thermal process metal base |
| title | ANALYSIS OF THE THERMAL EFFECT OF TWO INTERNAL PARALLEL PRINTED CIRCUIT BOARD CONDUCTORS MOUNTED ON A METAL BASE AND LOCATED IN ONE LAYER |
| title_full | ANALYSIS OF THE THERMAL EFFECT OF TWO INTERNAL PARALLEL PRINTED CIRCUIT BOARD CONDUCTORS MOUNTED ON A METAL BASE AND LOCATED IN ONE LAYER |
| title_fullStr | ANALYSIS OF THE THERMAL EFFECT OF TWO INTERNAL PARALLEL PRINTED CIRCUIT BOARD CONDUCTORS MOUNTED ON A METAL BASE AND LOCATED IN ONE LAYER |
| title_full_unstemmed | ANALYSIS OF THE THERMAL EFFECT OF TWO INTERNAL PARALLEL PRINTED CIRCUIT BOARD CONDUCTORS MOUNTED ON A METAL BASE AND LOCATED IN ONE LAYER |
| title_short | ANALYSIS OF THE THERMAL EFFECT OF TWO INTERNAL PARALLEL PRINTED CIRCUIT BOARD CONDUCTORS MOUNTED ON A METAL BASE AND LOCATED IN ONE LAYER |
| title_sort | analysis of the thermal effect of two internal parallel printed circuit board conductors mounted on a metal base and located in one layer |
| topic | printed conductor printed circuit board approximation thermal process metal base |
| work_keys_str_mv | AT alekseyvkostin analysisofthethermaleffectoftwointernalparallelprintedcircuitboardconductorsmountedonametalbaseandlocatedinonelayer AT dmitriysbogdanov analysisofthethermaleffectoftwointernalparallelprintedcircuitboardconductorsmountedonametalbaseandlocatedinonelayer AT igorsbobrov analysisofthethermaleffectoftwointernalparallelprintedcircuitboardconductorsmountedonametalbaseandlocatedinonelayer |