Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components
This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different w...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-02-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/16/4/1702 |
| _version_ | 1797619564727500800 |
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| author | Dibakor Boruah Nele Dewagtere Bilal Ahmad Rafael Nunes Jeroen Tacq Xiang Zhang Hua Guo Wim Verlinde Wim De Waele |
| author_facet | Dibakor Boruah Nele Dewagtere Bilal Ahmad Rafael Nunes Jeroen Tacq Xiang Zhang Hua Guo Wim Verlinde Wim De Waele |
| author_sort | Dibakor Boruah |
| collection | DOAJ |
| description | This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction. |
| first_indexed | 2024-03-11T08:29:52Z |
| format | Article |
| id | doaj.art-dd145a013c4446f4b079d4b37d223ed6 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-11T08:29:52Z |
| publishDate | 2023-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-dd145a013c4446f4b079d4b37d223ed62023-11-16T21:53:21ZengMDPI AGMaterials1996-19442023-02-01164170210.3390/ma16041702Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured ComponentsDibakor Boruah0Nele Dewagtere1Bilal Ahmad2Rafael Nunes3Jeroen Tacq4Xiang Zhang5Hua Guo6Wim Verlinde7Wim De Waele8Department of Electromechanical, Systems and Metal Engineering, Faculty of Engineering and Architecture, Ghent University, 9052 Ghent, BelgiumDepartment of Electromechanical, Systems and Metal Engineering, Faculty of Engineering and Architecture, Ghent University, 9052 Ghent, BelgiumFaculty of Engineering, Environment and Computing, Coventry University, Coventry CV1 5FB, UKBelgian Welding Institute, 9052 Ghent, BelgiumSirris, 9052 Ghent, BelgiumFaculty of Engineering, Environment and Computing, Coventry University, Coventry CV1 5FB, UKFaculty of Engineering, Environment and Computing, Coventry University, Coventry CV1 5FB, UKBelgian Welding Institute, 9052 Ghent, BelgiumDepartment of Electromechanical, Systems and Metal Engineering, Faculty of Engineering and Architecture, Ghent University, 9052 Ghent, BelgiumThis study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.https://www.mdpi.com/1996-1944/16/4/1702additive manufacturingcontour methoddigital image correlationresidual stresseswire + arc additive manufacturingX-ray diffraction |
| spellingShingle | Dibakor Boruah Nele Dewagtere Bilal Ahmad Rafael Nunes Jeroen Tacq Xiang Zhang Hua Guo Wim Verlinde Wim De Waele Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components Materials additive manufacturing contour method digital image correlation residual stresses wire + arc additive manufacturing X-ray diffraction |
| title | Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components |
| title_full | Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components |
| title_fullStr | Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components |
| title_full_unstemmed | Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components |
| title_short | Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components |
| title_sort | digital image correlation for measuring full field residual stresses in wire and arc additive manufactured components |
| topic | additive manufacturing contour method digital image correlation residual stresses wire + arc additive manufacturing X-ray diffraction |
| url | https://www.mdpi.com/1996-1944/16/4/1702 |
| work_keys_str_mv | AT dibakorboruah digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents AT neledewagtere digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents AT bilalahmad digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents AT rafaelnunes digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents AT jeroentacq digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents AT xiangzhang digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents AT huaguo digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents AT wimverlinde digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents AT wimdewaele digitalimagecorrelationformeasuringfullfieldresidualstressesinwireandarcadditivemanufacturedcomponents |