Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different w...

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Bibliographic Details
Main Authors:	Dibakor Boruah, Nele Dewagtere, Bilal Ahmad, Rafael Nunes, Jeroen Tacq, Xiang Zhang, Hua Guo, Wim Verlinde, Wim De Waele
Format:	Article
Language:	English
Published:	MDPI AG 2023-02-01
Series:	Materials
Subjects:	additive manufacturing contour method digital image correlation residual stresses wire + arc additive manufacturing X-ray diffraction
Online Access:	https://www.mdpi.com/1996-1944/16/4/1702

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