Solid state wetting and dynamics of solid surface nanorelief
Using molecular dynamics solid state wetting in the Cu (nanoparticle) / Cu (substrate) system was studied. It has been found that the solid state spreading mechanism corresponds, first of all, to the surface diffusion that was confirmed by the linear dependence of square radii of the first monolayer...
| Main Authors: | , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Tver State University
2018-12-01
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| Series: | Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов |
| Subjects: | |
| Online Access: | https://physchemaspects.ru/archives/2018/fh2018-doi-10-26456-pcascnn-2018-10-083.pdf |
| Summary: | Using molecular dynamics solid state wetting in the Cu (nanoparticle) / Cu (substrate) system was studied. It has been found that the solid state spreading mechanism corresponds, first of all, to the surface diffusion that was confirmed by the linear dependence of square radii of the first monolayer on the spreading time. A hypophysis was put forward and justified that the degradation of nanorelief of the solid surface occurs by means of the solid state wetting mechanism. |
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| ISSN: | 2226-4442 2226-4442 |