Fabrication of Cu+ sites in confined spaces for adsorptive desulfurization by series connection double-solvent strategy
Cu+-containing materials have shown various application prospects especially in adsorption and catalysis, because they are versatile, non-toxic and low cost. To date, developing a mild and controllable approach for the fabrication of Cu+ sites has remained a pronounced challenge. Herein, we report a...
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KeAi Communications Co., Ltd.
2022-04-01
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Series: | Green Energy & Environment |
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Online Access: | http://www.sciencedirect.com/science/article/pii/S2468025720301667 |
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author | Shu Shi Yu-Xia Li Shuai-Shuai Li Xiao-Qin Liu Lin-Bing Sun |
author_facet | Shu Shi Yu-Xia Li Shuai-Shuai Li Xiao-Qin Liu Lin-Bing Sun |
author_sort | Shu Shi |
collection | DOAJ |
description | Cu+-containing materials have shown various application prospects especially in adsorption and catalysis, because they are versatile, non-toxic and low cost. To date, developing a mild and controllable approach for the fabrication of Cu+ sites has remained a pronounced challenge. Herein, we report a series connection double-solvent strategy (SCDS) for fabricating Cu+ sites within MIL-101(Cr), a typical metal–organic framework. By employing the SCDS in which vitamin C is chosen as the environmentally benign reducing agent, Cu2+ was incorporated in the pores and then transformed to Cu+ in the confined spaces. Compared to the conventional high-temperature autoreduction method conducted under harsh environment (700 °C for 12 h) with a low Cu+ yield (less than 50%), SCDS can selectively reduce Cu2+ to Cu+ at room temperature without generating any Cu0. The resulting Cu+ modified MIL-101(Cr) exhibits good desulfurization performance in view of both uptake and recyclability. |
first_indexed | 2024-12-20T15:23:57Z |
format | Article |
id | doaj.art-de7a4acc09c24019a93070486255fd94 |
institution | Directory Open Access Journal |
issn | 2468-0257 |
language | English |
last_indexed | 2024-12-20T15:23:57Z |
publishDate | 2022-04-01 |
publisher | KeAi Communications Co., Ltd. |
record_format | Article |
series | Green Energy & Environment |
spelling | doaj.art-de7a4acc09c24019a93070486255fd942022-12-21T19:35:55ZengKeAi Communications Co., Ltd.Green Energy & Environment2468-02572022-04-0172345351Fabrication of Cu+ sites in confined spaces for adsorptive desulfurization by series connection double-solvent strategyShu Shi0Yu-Xia Li1Shuai-Shuai Li2Xiao-Qin Liu3Lin-Bing Sun4State Key Laboratory of Materials-Oriented Chemical Engineering, Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), College of Chemical Engineering, Nanjing Tech University, 30 South Puzhu Road, Nanjing 211816, ChinaState Key Laboratory of Materials-Oriented Chemical Engineering, Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), College of Chemical Engineering, Nanjing Tech University, 30 South Puzhu Road, Nanjing 211816, ChinaState Key Laboratory of Materials-Oriented Chemical Engineering, Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), College of Chemical Engineering, Nanjing Tech University, 30 South Puzhu Road, Nanjing 211816, ChinaState Key Laboratory of Materials-Oriented Chemical Engineering, Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), College of Chemical Engineering, Nanjing Tech University, 30 South Puzhu Road, Nanjing 211816, ChinaCorresponding author.; State Key Laboratory of Materials-Oriented Chemical Engineering, Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), College of Chemical Engineering, Nanjing Tech University, 30 South Puzhu Road, Nanjing 211816, ChinaCu+-containing materials have shown various application prospects especially in adsorption and catalysis, because they are versatile, non-toxic and low cost. To date, developing a mild and controllable approach for the fabrication of Cu+ sites has remained a pronounced challenge. Herein, we report a series connection double-solvent strategy (SCDS) for fabricating Cu+ sites within MIL-101(Cr), a typical metal–organic framework. By employing the SCDS in which vitamin C is chosen as the environmentally benign reducing agent, Cu2+ was incorporated in the pores and then transformed to Cu+ in the confined spaces. Compared to the conventional high-temperature autoreduction method conducted under harsh environment (700 °C for 12 h) with a low Cu+ yield (less than 50%), SCDS can selectively reduce Cu2+ to Cu+ at room temperature without generating any Cu0. The resulting Cu+ modified MIL-101(Cr) exhibits good desulfurization performance in view of both uptake and recyclability.http://www.sciencedirect.com/science/article/pii/S2468025720301667Double-solvent methodπ-complexation adsorptionSelective reductionDeep desulfurization |
spellingShingle | Shu Shi Yu-Xia Li Shuai-Shuai Li Xiao-Qin Liu Lin-Bing Sun Fabrication of Cu+ sites in confined spaces for adsorptive desulfurization by series connection double-solvent strategy Green Energy & Environment Double-solvent method π-complexation adsorption Selective reduction Deep desulfurization |
title | Fabrication of Cu+ sites in confined spaces for adsorptive desulfurization by series connection double-solvent strategy |
title_full | Fabrication of Cu+ sites in confined spaces for adsorptive desulfurization by series connection double-solvent strategy |
title_fullStr | Fabrication of Cu+ sites in confined spaces for adsorptive desulfurization by series connection double-solvent strategy |
title_full_unstemmed | Fabrication of Cu+ sites in confined spaces for adsorptive desulfurization by series connection double-solvent strategy |
title_short | Fabrication of Cu+ sites in confined spaces for adsorptive desulfurization by series connection double-solvent strategy |
title_sort | fabrication of cu sites in confined spaces for adsorptive desulfurization by series connection double solvent strategy |
topic | Double-solvent method π-complexation adsorption Selective reduction Deep desulfurization |
url | http://www.sciencedirect.com/science/article/pii/S2468025720301667 |
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