Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy
The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with negligible loss of the plasticity. Especially, th...
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Format: | Article |
Language: | English |
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Elsevier
2023-09-01
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Series: | Journal of Materials Research and Technology |
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Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423021233 |
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author | Tianhan Hu Shun Li Zhen Li Guanzhi Wu Ping Zhu Wufeng Dong Yu Sun Jiayi Zhou Bingjia Wu Bingge Zhao Kai Ding Yulai Gao |
author_facet | Tianhan Hu Shun Li Zhen Li Guanzhi Wu Ping Zhu Wufeng Dong Yu Sun Jiayi Zhou Bingjia Wu Bingge Zhao Kai Ding Yulai Gao |
author_sort | Tianhan Hu |
collection | DOAJ |
description | The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with negligible loss of the plasticity. Especially, the Sn–Bi solder alloy with 0.4 wt. % Ag and 1.5 wt. % In exhibits the maximum tensile strength and elongation of 79.7 MPa and 45.9%, respectively. The microstructure of the Sn–Bi solder alloys is mainly composed of Bi-rich and β-Sn phases. With the addition of elements Ag and In, the microstructure is significantly refined, and the lamellar eutectic structure with thinner interlayer spacing could be detected. Element Ag tends to form Ag3Sn phase while element In solutes in the Sn matrix. The mechanical properties of the as-prepared Sn–Bi solder alloy are improved attributed to the precipitated-phase strengthening of the fined Ag3Sn phase and the refinement effect of In on coarse Bi-rich phase. |
first_indexed | 2024-03-11T15:06:17Z |
format | Article |
id | doaj.art-dfc43d9535f044e594db1fc0de0785ac |
institution | Directory Open Access Journal |
issn | 2238-7854 |
language | English |
last_indexed | 2024-03-11T15:06:17Z |
publishDate | 2023-09-01 |
publisher | Elsevier |
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series | Journal of Materials Research and Technology |
spelling | doaj.art-dfc43d9535f044e594db1fc0de0785ac2023-10-30T06:04:13ZengElsevierJournal of Materials Research and Technology2238-78542023-09-012659025909Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloyTianhan Hu0Shun Li1Zhen Li2Guanzhi Wu3Ping Zhu4Wufeng Dong5Yu Sun6Jiayi Zhou7Bingjia Wu8Bingge Zhao9Kai Ding10Yulai Gao11State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR ChinaState Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China; Corresponding author.State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China; Shanghai Engineering Research Center for Metal Parts Green Remanufacture, Shanghai 200444, PR China; Corresponding author. State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China.The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with negligible loss of the plasticity. Especially, the Sn–Bi solder alloy with 0.4 wt. % Ag and 1.5 wt. % In exhibits the maximum tensile strength and elongation of 79.7 MPa and 45.9%, respectively. The microstructure of the Sn–Bi solder alloys is mainly composed of Bi-rich and β-Sn phases. With the addition of elements Ag and In, the microstructure is significantly refined, and the lamellar eutectic structure with thinner interlayer spacing could be detected. Element Ag tends to form Ag3Sn phase while element In solutes in the Sn matrix. The mechanical properties of the as-prepared Sn–Bi solder alloy are improved attributed to the precipitated-phase strengthening of the fined Ag3Sn phase and the refinement effect of In on coarse Bi-rich phase.http://www.sciencedirect.com/science/article/pii/S2238785423021233Sn–Bi solder alloyAg additionIn additionMechanical propertiesAg3Sn phase |
spellingShingle | Tianhan Hu Shun Li Zhen Li Guanzhi Wu Ping Zhu Wufeng Dong Yu Sun Jiayi Zhou Bingjia Wu Bingge Zhao Kai Ding Yulai Gao Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy Journal of Materials Research and Technology Sn–Bi solder alloy Ag addition In addition Mechanical properties Ag3Sn phase |
title | Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy |
title_full | Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy |
title_fullStr | Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy |
title_full_unstemmed | Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy |
title_short | Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy |
title_sort | coupled effect of ag and in addition on the microstructure and mechanical properties of sn bi lead free solder alloy |
topic | Sn–Bi solder alloy Ag addition In addition Mechanical properties Ag3Sn phase |
url | http://www.sciencedirect.com/science/article/pii/S2238785423021233 |
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