Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with negligible loss of the plasticity. Especially, th...

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Bibliographic Details
Main Authors: Tianhan Hu, Shun Li, Zhen Li, Guanzhi Wu, Ping Zhu, Wufeng Dong, Yu Sun, Jiayi Zhou, Bingjia Wu, Bingge Zhao, Kai Ding, Yulai Gao
Format: Article
Language:English
Published: Elsevier 2023-09-01
Series:Journal of Materials Research and Technology
Subjects:
Sn–Bi solder alloy
Ag addition
In addition
Mechanical properties
Ag3Sn phase
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423021233

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