The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates
The preparation of new solder joint materials for chip packaging by designing a variety of brazing material mixes has become one of the future research directions for solder joints. They added low melting point elements to traditional solder materials to prepare low-temperature hybrid solder to meet...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423029009 |