Microstructure and Bonding Strength of Low-Temperature Sintered Ag/Nano-Ag Films/Ag Joints
Nano-Ag paste is one of the most widely used die-attachment materials in modern electronic devices, which are gaining continuously increasing application in transportation industries. The nano-Ag film in a pre-formed dimension and free from the use of chemical dispersing agents has been proposed to...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-10-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/13/11/1833 |