SPICE-Aided Nonlinear Electrothermal Modeling of an IGBT Module
The paper proposes a compact electrothermal model of the IGBT module in the form of a subcircuit for SPICE. This model simultaneously takes into account electrical phenomena occurring in the module components and thermal phenomena occurring in this module. In the description of electrical phenomena,...
Main Authors: | Krzysztof Górecki, Paweł Górecki |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-11-01
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Series: | Electronics |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-9292/12/22/4588 |
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