Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging
This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical infl...
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MDPI AG
2023-04-01
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| Online Access: | https://www.mdpi.com/1996-1944/16/9/3482 |
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| author | Wan-Chun Chuang Yi Huang Po-En Chen |
| author_facet | Wan-Chun Chuang Yi Huang Po-En Chen |
| author_sort | Wan-Chun Chuang |
| collection | DOAJ |
| description | This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical influencing factors and quantify the effects of each parameter on wafer warpage. The material properties include Young’s modulus of the epoxy molding compound before and after the glass transition temperature (Tg) range of 25–35 °C (E<sub>L</sub>) and 235–260 °C (E<sub>H</sub>), coefficient of thermal expansion (α1, α2), and the temperature change (∆T) between E<sub>L</sub> and E<sub>H</sub>. Results show that, within the range of extreme values of material properties, E<sub>L</sub> and α1 are the critical factors that affect wafer warpage during the decarrier process in fan-out packaging. α1 has a more significant impact on wafer warpage compared with E<sub>L</sub>. E<sub>H</sub>, α2, Tg, and ∆T have little influence on wafer warpage. Additionally, the study identified the optimized material property of the epoxy molding compound that can reduce the maximum wafer warpage in the X and Y directions from initial values of 7.34 mm and 7.189 mm to 0.545 mm and 0.45 mm, respectively, resulting in a reduction of wafer warpage of 92.58% (X direction) and 93.74% (Y direction). Thus, this study proposes an approach for evaluating the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. The approach aims to address the issue of excessive wafer warpage due to material variation and to provide criteria for selecting appropriate epoxy molding compounds to enhance process yield in packaging production lines. |
| first_indexed | 2024-03-11T04:14:37Z |
| format | Article |
| id | doaj.art-e17ea64e90ee42ff87287e2a4d9e9930 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-11T04:14:37Z |
| publishDate | 2023-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-e17ea64e90ee42ff87287e2a4d9e99302023-11-17T23:16:42ZengMDPI AGMaterials1996-19442023-04-01169348210.3390/ma16093482Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level PackagingWan-Chun Chuang0Yi Huang1Po-En Chen2Department of Mechanical and Electromechanical Engineering, Engineering Technology Research & Promotion Center, National Sun Yat-sen University, Kaohsiung 804, TaiwanDepartment of Mechanical and Electromechanical Engineering, Engineering Technology Research & Promotion Center, National Sun Yat-sen University, Kaohsiung 804, TaiwanDepartment of Mechanical and Electromechanical Engineering, Engineering Technology Research & Promotion Center, National Sun Yat-sen University, Kaohsiung 804, TaiwanThis study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical influencing factors and quantify the effects of each parameter on wafer warpage. The material properties include Young’s modulus of the epoxy molding compound before and after the glass transition temperature (Tg) range of 25–35 °C (E<sub>L</sub>) and 235–260 °C (E<sub>H</sub>), coefficient of thermal expansion (α1, α2), and the temperature change (∆T) between E<sub>L</sub> and E<sub>H</sub>. Results show that, within the range of extreme values of material properties, E<sub>L</sub> and α1 are the critical factors that affect wafer warpage during the decarrier process in fan-out packaging. α1 has a more significant impact on wafer warpage compared with E<sub>L</sub>. E<sub>H</sub>, α2, Tg, and ∆T have little influence on wafer warpage. Additionally, the study identified the optimized material property of the epoxy molding compound that can reduce the maximum wafer warpage in the X and Y directions from initial values of 7.34 mm and 7.189 mm to 0.545 mm and 0.45 mm, respectively, resulting in a reduction of wafer warpage of 92.58% (X direction) and 93.74% (Y direction). Thus, this study proposes an approach for evaluating the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. The approach aims to address the issue of excessive wafer warpage due to material variation and to provide criteria for selecting appropriate epoxy molding compounds to enhance process yield in packaging production lines.https://www.mdpi.com/1996-1944/16/9/3482fan-out wafer-level packagingwarpageepoxy molding compoundfinite element analysis |
| spellingShingle | Wan-Chun Chuang Yi Huang Po-En Chen Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging Materials fan-out wafer-level packaging warpage epoxy molding compound finite element analysis |
| title | Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging |
| title_full | Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging |
| title_fullStr | Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging |
| title_full_unstemmed | Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging |
| title_short | Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging |
| title_sort | exploring the influence of material properties of epoxy molding compound on wafer warpage in fan out wafer level packaging |
| topic | fan-out wafer-level packaging warpage epoxy molding compound finite element analysis |
| url | https://www.mdpi.com/1996-1944/16/9/3482 |
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