Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging
This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical infl...
Main Authors: | Wan-Chun Chuang, Yi Huang, Po-En Chen |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-04-01
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Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/16/9/3482 |
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