Ultracompact Multielectrode Array for Neurological Monitoring
Patients with paralysis, spinal cord injury, or amputated limbs could benefit from using brain−machine interface technology for communication and neurorehabilitation. In this study, a 32-channel three-dimensional (3D) multielectrode probe array was developed for the neural interface system...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2019-05-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/19/10/2286 |
| _version_ | 1798040365723287552 |
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| author | Ming-Yuan Cheng Ramona B. Damalerio Weiguo Chen Ramamoorthy Rajkumar Gavin S. Dawe |
| author_facet | Ming-Yuan Cheng Ramona B. Damalerio Weiguo Chen Ramamoorthy Rajkumar Gavin S. Dawe |
| author_sort | Ming-Yuan Cheng |
| collection | DOAJ |
| description | Patients with paralysis, spinal cord injury, or amputated limbs could benefit from using brain−machine interface technology for communication and neurorehabilitation. In this study, a 32-channel three-dimensional (3D) multielectrode probe array was developed for the neural interface system of a brain−machine interface to monitor neural activity. A novel microassembly technique involving lead transfer was used to prevent misalignment in the bonding plane during the orthogonal assembly of the 3D multielectrode probe array. Standard microassembly and biopackaging processes were utilized to implement the proposed lead transfer technique. The maximum profile of the integrated 3D neural device was set to 0.50 mm above the pia mater to reduce trauma to brain cells. Benchtop tests characterized the electrical impedance of the neural device. A characterization test revealed that the impedance of the 3D multielectrode probe array was on average approximately 0.55 MΩ at a frequency of 1 KHz. Moreover, in vitro cytotoxicity tests verified the biocompatibility of the device. Subsequently, 3D multielectrode probe arrays were implanted in rats and exhibited the capability to record local field potentials and spike signals. |
| first_indexed | 2024-04-11T22:06:37Z |
| format | Article |
| id | doaj.art-e25bf26486184c308e7c954e5eea5618 |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-04-11T22:06:37Z |
| publishDate | 2019-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-e25bf26486184c308e7c954e5eea56182022-12-22T04:00:42ZengMDPI AGSensors1424-82202019-05-011910228610.3390/s19102286s19102286Ultracompact Multielectrode Array for Neurological MonitoringMing-Yuan Cheng0Ramona B. Damalerio1Weiguo Chen2Ramamoorthy Rajkumar3Gavin S. Dawe4Institute of Microelectronics, Agency for Science, Technology and Research, Singapore 138634, SingaporeInstitute of Microelectronics, Agency for Science, Technology and Research, Singapore 138634, SingaporeInstitute of Microelectronics, Agency for Science, Technology and Research, Singapore 138634, SingaporeDepartment of Pharmacology, Yong Loo Lin School of Medicine, National University Health System, National University of Singapore, Singapore 117600, SingaporeDepartment of Pharmacology, Yong Loo Lin School of Medicine, National University Health System, National University of Singapore, Singapore 117600, SingaporePatients with paralysis, spinal cord injury, or amputated limbs could benefit from using brain−machine interface technology for communication and neurorehabilitation. In this study, a 32-channel three-dimensional (3D) multielectrode probe array was developed for the neural interface system of a brain−machine interface to monitor neural activity. A novel microassembly technique involving lead transfer was used to prevent misalignment in the bonding plane during the orthogonal assembly of the 3D multielectrode probe array. Standard microassembly and biopackaging processes were utilized to implement the proposed lead transfer technique. The maximum profile of the integrated 3D neural device was set to 0.50 mm above the pia mater to reduce trauma to brain cells. Benchtop tests characterized the electrical impedance of the neural device. A characterization test revealed that the impedance of the 3D multielectrode probe array was on average approximately 0.55 MΩ at a frequency of 1 KHz. Moreover, in vitro cytotoxicity tests verified the biocompatibility of the device. Subsequently, 3D multielectrode probe arrays were implanted in rats and exhibited the capability to record local field potentials and spike signals.https://www.mdpi.com/1424-8220/19/10/2286biopackaginglead transferneural probe array microassemblymicroelectromechanical systems |
| spellingShingle | Ming-Yuan Cheng Ramona B. Damalerio Weiguo Chen Ramamoorthy Rajkumar Gavin S. Dawe Ultracompact Multielectrode Array for Neurological Monitoring Sensors biopackaging lead transfer neural probe array microassembly microelectromechanical systems |
| title | Ultracompact Multielectrode Array for Neurological Monitoring |
| title_full | Ultracompact Multielectrode Array for Neurological Monitoring |
| title_fullStr | Ultracompact Multielectrode Array for Neurological Monitoring |
| title_full_unstemmed | Ultracompact Multielectrode Array for Neurological Monitoring |
| title_short | Ultracompact Multielectrode Array for Neurological Monitoring |
| title_sort | ultracompact multielectrode array for neurological monitoring |
| topic | biopackaging lead transfer neural probe array microassembly microelectromechanical systems |
| url | https://www.mdpi.com/1424-8220/19/10/2286 |
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