Low-Temperature Sintering of Ag Composite Pastes with Different Metal Organic Decomposition Additions
Rapid developments in wide-bandgap semiconductors have led to the demand for interconnection materials that can withstand harsh conditions. In this study, novel Ag composite pastes were developed with the assistance of metal organic decomposition (MOD) to significantly reduce the sintering temperatu...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-03-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/16/6/2340 |