Low-Temperature Sinterable Cu@Ag Paste with Superior Strength Driven by Pre-Heating Process

Low-Temperature Sinterable Cu@Ag Paste with Superior Strength Driven by Pre-Heating Process

To preserve the structural integrity of power semiconductor devices, ensuring a reliable connection between wide-bandgap (WBG) chips and their substrates at temperatures above 200 °C is crucial. Therefore, easily processable chip-attach materials with high bonding strengths at high temperatures shou...

Full description

Bibliographic Details
Main Authors: Miso Won, Dajung Kim, Hyunseung Yang, Chulmin Oh
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Energies
Subjects:
Ag-coated Cu particles
metal matrix composite
interface
sintered joints
power electronics
Online Access:https://www.mdpi.com/1996-1073/16/14/5419

Similar Items

Similar Items