Nanoscale removal mechanisms in abrasive machining of brittle solids
Brittle solids with dominant covalent-ionic bonding, including single crystals, polycrystals, and optical glass, are core materials for modern microelectronic and optoelectronic devices that are widely used in energy, communication, transportation, and medicine sectors. In high performance device ap...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
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Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2022-06-01
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| Series: | Jin'gangshi yu moliao moju gongcheng |
| Subjects: | |
| Online Access: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2021.3009 |
| _version_ | 1797805930912415744 |
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| author | Shuiquan HUANG Shang GAO Chuanzhen HUANG Han HUANG |
| author_facet | Shuiquan HUANG Shang GAO Chuanzhen HUANG Han HUANG |
| author_sort | Shuiquan HUANG |
| collection | DOAJ |
| description | Brittle solids with dominant covalent-ionic bonding, including single crystals, polycrystals, and optical glass, are core materials for modern microelectronic and optoelectronic devices that are widely used in energy, communication, transportation, and medicine sectors. In high performance device applications, those brittle materials must be machined into parts that often have an extremely smooth surface and a damage-free subsurface with sub-micron precision. Optimisation of an abrasive machining process for the brittle solids can significantly enhance production efficiency and reduce manufacturing cost, as well as prolong device life. The development of high efficiency and low damage ultraprecision shaping technologies for this class of solids requires an in-depth understanding of their deformation and removal mechanisms at nanoscale. In this work, the fundamental mechanisms of deformation and removal of brittle materials involved in individual or cumulative contacts with blunt and sharp grits are analysed, using the scratch-related micromechanics as the theoretical basis. Essentials of brittle-to-ductile transitions in abrasive machining are outlined. Influence of the diversity in material microstructures in determining local deformation and subsequent removal is highlighted. Practical requirements are suggested for further advancing ultraprecision abrasive machining of those brittle solids. |
| first_indexed | 2024-03-13T05:59:34Z |
| format | Article |
| id | doaj.art-e3bc39c721a24063964ebd8dc1b746f1 |
| institution | Directory Open Access Journal |
| issn | 1006-852X |
| language | zho |
| last_indexed | 2024-03-13T05:59:34Z |
| publishDate | 2022-06-01 |
| publisher | Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. |
| record_format | Article |
| series | Jin'gangshi yu moliao moju gongcheng |
| spelling | doaj.art-e3bc39c721a24063964ebd8dc1b746f12023-06-13T01:54:00ZzhoZhengzhou Research Institute for Abrasives & Grinding Co., Ltd.Jin'gangshi yu moliao moju gongcheng1006-852X2022-06-0142325726710.13394/j.cnki.jgszz.2021.3009zxh3hsqNanoscale removal mechanisms in abrasive machining of brittle solidsShuiquan HUANG0Shang GAO1Chuanzhen HUANG2Han HUANG3School of Mechanical Engineering, Yanshan University, Qinhuangdao 066004, Hebei, ChinaKey Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, Liaoning, ChinaSchool of Mechanical Engineering, Yanshan University, Qinhuangdao 066004, Hebei, ChinaSchool of Mechanical and Mining Engineering, The University of Queensland, Queensland 4072, AustraliaBrittle solids with dominant covalent-ionic bonding, including single crystals, polycrystals, and optical glass, are core materials for modern microelectronic and optoelectronic devices that are widely used in energy, communication, transportation, and medicine sectors. In high performance device applications, those brittle materials must be machined into parts that often have an extremely smooth surface and a damage-free subsurface with sub-micron precision. Optimisation of an abrasive machining process for the brittle solids can significantly enhance production efficiency and reduce manufacturing cost, as well as prolong device life. The development of high efficiency and low damage ultraprecision shaping technologies for this class of solids requires an in-depth understanding of their deformation and removal mechanisms at nanoscale. In this work, the fundamental mechanisms of deformation and removal of brittle materials involved in individual or cumulative contacts with blunt and sharp grits are analysed, using the scratch-related micromechanics as the theoretical basis. Essentials of brittle-to-ductile transitions in abrasive machining are outlined. Influence of the diversity in material microstructures in determining local deformation and subsequent removal is highlighted. Practical requirements are suggested for further advancing ultraprecision abrasive machining of those brittle solids.http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2021.3009brittle materialsabrasive machiningdeformationfractureremoval mechanism |
| spellingShingle | Shuiquan HUANG Shang GAO Chuanzhen HUANG Han HUANG Nanoscale removal mechanisms in abrasive machining of brittle solids Jin'gangshi yu moliao moju gongcheng brittle materials abrasive machining deformation fracture removal mechanism |
| title | Nanoscale removal mechanisms in abrasive machining of brittle solids |
| title_full | Nanoscale removal mechanisms in abrasive machining of brittle solids |
| title_fullStr | Nanoscale removal mechanisms in abrasive machining of brittle solids |
| title_full_unstemmed | Nanoscale removal mechanisms in abrasive machining of brittle solids |
| title_short | Nanoscale removal mechanisms in abrasive machining of brittle solids |
| title_sort | nanoscale removal mechanisms in abrasive machining of brittle solids |
| topic | brittle materials abrasive machining deformation fracture removal mechanism |
| url | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2021.3009 |
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