High Quality Pt–Pt Metal Bonding for High Temperature Packaging

High Quality Pt–Pt Metal Bonding for High Temperature Packaging

Platinum is an ideal material for high-temperature resistant device packaging due to its higher melting point and good electrical properties. In this paper, the thermocompression bonding of Pt–Pt metal electrodes was successfully realized through process exploration, and the package interconnection...

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Bibliographic Details
Main Authors:	Jiazheng Liu, Junqiang Wang, Mengwei Li, Haikun Zhang
Format:	Article
Language:	English
Published:	MDPI AG 2022-09-01
Series:	Micromachines
Subjects:	Pt–Pt interconnection high-temperature resistant packaging metallic bonding
Online Access:	https://www.mdpi.com/2072-666X/13/9/1543

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