A comparative study of a front opening unified pod (FOUP) moisture removal efficiency with different purging gases

A comparative study of a front opening unified pod (FOUP) moisture removal efficiency with different purging gases

Airborne molecular contamination (AMC) is one of the main causes of chip products defects during manufacturing. The downward moist air flow originated from the fan filter unit (FFU) inside the mini-environment (ME) can penetrate into the front opening unified pod (FOUP) and cause wafer defects. Purg...

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Bibliographic Details
Main Authors: David Benalcazar, Tee Lin, Ming-Hsuan Hu, Omid Ali Zargar, Shao-Yu Lin, Yang-Cheng Shih, Graham Leggett
Format: Article
Language:English
Published: Elsevier 2022-11-01
Series:International Journal of Thermofluids
Subjects:
FOUP, ME
AMCs
RH
CFD
LES
Nitrogen purge
Online Access:http://www.sciencedirect.com/science/article/pii/S2666202722000623

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