Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage
Summary: Flexible polymer dielectrics which can function well at elevated temperatures continue to be significant in harsh condition energy storage. However, state-of-the-art high-temperature polymers traditionally designed with conjugated structures for better thermal stability have compromised ban...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2022-07-01
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| Series: | iScience |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589004222008732 |
| _version_ | 1811230809781174272 |
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| author | Chao Wu Anna Marie LaChance Mohamadreza Arab Baferani Kuangyu Shen Zongze Li Zaili Hou Ningzhen Wang Yifei Wang Luyi Sun Yang Cao |
| author_facet | Chao Wu Anna Marie LaChance Mohamadreza Arab Baferani Kuangyu Shen Zongze Li Zaili Hou Ningzhen Wang Yifei Wang Luyi Sun Yang Cao |
| author_sort | Chao Wu |
| collection | DOAJ |
| description | Summary: Flexible polymer dielectrics which can function well at elevated temperatures continue to be significant in harsh condition energy storage. However, state-of-the-art high-temperature polymers traditionally designed with conjugated structures for better thermal stability have compromised bandgaps and charge injection barriers. Here, we demonstrate a self-assembled polyvinyl alcohol (PVA)/montmorillonite (MMT) coating to impede charge carriers injecting into the polyimide (PI) polymer film. The anisotropic conductivity of the 2D nanolayered coating further dissipates the energy of charges through tortuous injection pathways. With the coating, high field pre-breakdown conduction measurement and space-charge profiling of PI films reveal a clear shifting of the dominant mode of conduction from the bulk-limited hopping to Schottky-injection limited conduction. The coating thus imparts PI films with a significantly suppressed electrical conduction (∼10×), and substantially improved discharge efficiency (7×) and energy density (2.7×) at 150°C. The facile and scalable flow-induced fabrication unleash enormous applications for harsh condition electrification. |
| first_indexed | 2024-04-12T10:35:19Z |
| format | Article |
| id | doaj.art-e51468fa47f041bf957121f771abec58 |
| institution | Directory Open Access Journal |
| issn | 2589-0042 |
| language | English |
| last_indexed | 2024-04-12T10:35:19Z |
| publishDate | 2022-07-01 |
| publisher | Elsevier |
| record_format | Article |
| series | iScience |
| spelling | doaj.art-e51468fa47f041bf957121f771abec582022-12-22T03:36:45ZengElsevieriScience2589-00422022-07-01257104601Scalable self-assembly interfacial engineering for high-temperature dielectric energy storageChao Wu0Anna Marie LaChance1Mohamadreza Arab Baferani2Kuangyu Shen3Zongze Li4Zaili Hou5Ningzhen Wang6Yifei Wang7Luyi Sun8Yang Cao9Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USAPolymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USA; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT 06269, USAElectrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USA; Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269, USAPolymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USA; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT 06269, USAElectrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USA; Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269, USAPolymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USA; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT 06269, USAElectrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USAElectrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USAPolymer Program, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USA; Department of Chemical and Biomolecular Engineering, University of Connecticut, Storrs, CT 06269, USA; Corresponding authorElectrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, CT 06269, USA; Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269, USA; Corresponding authorSummary: Flexible polymer dielectrics which can function well at elevated temperatures continue to be significant in harsh condition energy storage. However, state-of-the-art high-temperature polymers traditionally designed with conjugated structures for better thermal stability have compromised bandgaps and charge injection barriers. Here, we demonstrate a self-assembled polyvinyl alcohol (PVA)/montmorillonite (MMT) coating to impede charge carriers injecting into the polyimide (PI) polymer film. The anisotropic conductivity of the 2D nanolayered coating further dissipates the energy of charges through tortuous injection pathways. With the coating, high field pre-breakdown conduction measurement and space-charge profiling of PI films reveal a clear shifting of the dominant mode of conduction from the bulk-limited hopping to Schottky-injection limited conduction. The coating thus imparts PI films with a significantly suppressed electrical conduction (∼10×), and substantially improved discharge efficiency (7×) and energy density (2.7×) at 150°C. The facile and scalable flow-induced fabrication unleash enormous applications for harsh condition electrification.http://www.sciencedirect.com/science/article/pii/S2589004222008732Energy systemsInterface scienceMaterials science |
| spellingShingle | Chao Wu Anna Marie LaChance Mohamadreza Arab Baferani Kuangyu Shen Zongze Li Zaili Hou Ningzhen Wang Yifei Wang Luyi Sun Yang Cao Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage iScience Energy systems Interface science Materials science |
| title | Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage |
| title_full | Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage |
| title_fullStr | Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage |
| title_full_unstemmed | Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage |
| title_short | Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage |
| title_sort | scalable self assembly interfacial engineering for high temperature dielectric energy storage |
| topic | Energy systems Interface science Materials science |
| url | http://www.sciencedirect.com/science/article/pii/S2589004222008732 |
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