Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface Treatment
In order to improve energy efficiency by increasing heat dissipation performance of bus-bar which distributes the current in high-power switchboard, the heat dissipation effects of the shape modification and surface treatment of Cu bus-bar were studied. The surface temperatures of the conventional p...
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| Format: | Article |
| Language: | English |
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MDPI AG
2019-01-01
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| Series: | Energies |
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| Online Access: | http://www.mdpi.com/1996-1073/12/1/146 |
| _version_ | 1811280260966121472 |
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| author | Min-Jun Kim Sang-Hwan Bak Woo-Chul Jung Deog-Jae Hur Dong-Shin Ko Man-Sik Kong |
| author_facet | Min-Jun Kim Sang-Hwan Bak Woo-Chul Jung Deog-Jae Hur Dong-Shin Ko Man-Sik Kong |
| author_sort | Min-Jun Kim |
| collection | DOAJ |
| description | In order to improve energy efficiency by increasing heat dissipation performance of bus-bar which distributes the current in high-power switchboard, the heat dissipation effects of the shape modification and surface treatment of Cu bus-bar were studied. The surface temperatures of the conventional plate-type bus-bar, and the improved tunnel-type bus-bar were compared by using electromagnetic and thermal analyses. The optimum thickness of tunnel-type bus-bar and the spacing and array among three bus-bars were calculated; and the surface temperature of tunnel-type bus-bar showed 7.9 °C lower than that of plate-type bus-bar in a 3-phase array condition. In addition, the surface and internal temperatures of the uncoated, CNT (Carbon nanotube)-coated, and BN (Boron nitride)-coated Cu bus-bars were measured with thermal imaging camera and the experiment using a hot plate. It was confirmed that the difference in the internal temperature between uncoated and BN-coated Cu was 19.4 °C. The application of the bus-bar improved from this study might contribute to the increase in power energy efficiency. |
| first_indexed | 2024-04-13T01:11:34Z |
| format | Article |
| id | doaj.art-e5281323bf624953b638eac7ff88c24f |
| institution | Directory Open Access Journal |
| issn | 1996-1073 |
| language | English |
| last_indexed | 2024-04-13T01:11:34Z |
| publishDate | 2019-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Energies |
| spelling | doaj.art-e5281323bf624953b638eac7ff88c24f2022-12-22T03:09:09ZengMDPI AGEnergies1996-10732019-01-0112114610.3390/en12010146en12010146Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface TreatmentMin-Jun Kim0Sang-Hwan Bak1Woo-Chul Jung2Deog-Jae Hur3Dong-Shin Ko4Man-Sik Kong5Advanced Materials & Processing Center, Institute for Advanced Engineering (IAE), Yongin 175-28, KoreaAdvanced Materials & Processing Center, Institute for Advanced Engineering (IAE), Yongin 175-28, KoreaAdvanced Materials & Processing Center, Institute for Advanced Engineering (IAE), Yongin 175-28, KoreaResearch & Business Cooperation Center, Institute for Advanced Engineering (IAE), Yongin 175-28, KoreaResearch & Business Cooperation Center, Institute for Advanced Engineering (IAE), Yongin 175-28, KoreaAdvanced Materials & Processing Center, Institute for Advanced Engineering (IAE), Yongin 175-28, KoreaIn order to improve energy efficiency by increasing heat dissipation performance of bus-bar which distributes the current in high-power switchboard, the heat dissipation effects of the shape modification and surface treatment of Cu bus-bar were studied. The surface temperatures of the conventional plate-type bus-bar, and the improved tunnel-type bus-bar were compared by using electromagnetic and thermal analyses. The optimum thickness of tunnel-type bus-bar and the spacing and array among three bus-bars were calculated; and the surface temperature of tunnel-type bus-bar showed 7.9 °C lower than that of plate-type bus-bar in a 3-phase array condition. In addition, the surface and internal temperatures of the uncoated, CNT (Carbon nanotube)-coated, and BN (Boron nitride)-coated Cu bus-bars were measured with thermal imaging camera and the experiment using a hot plate. It was confirmed that the difference in the internal temperature between uncoated and BN-coated Cu was 19.4 °C. The application of the bus-bar improved from this study might contribute to the increase in power energy efficiency.http://www.mdpi.com/1996-1073/12/1/146switchboard systemCu bus-barheat dissipationelectromagnetic thermal analysisboron nitride coating |
| spellingShingle | Min-Jun Kim Sang-Hwan Bak Woo-Chul Jung Deog-Jae Hur Dong-Shin Ko Man-Sik Kong Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface Treatment Energies switchboard system Cu bus-bar heat dissipation electromagnetic thermal analysis boron nitride coating |
| title | Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface Treatment |
| title_full | Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface Treatment |
| title_fullStr | Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface Treatment |
| title_full_unstemmed | Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface Treatment |
| title_short | Improvement of Heat Dissipation Characteristics of Cu Bus-Bar in the Switchboards through Shape Modification and Surface Treatment |
| title_sort | improvement of heat dissipation characteristics of cu bus bar in the switchboards through shape modification and surface treatment |
| topic | switchboard system Cu bus-bar heat dissipation electromagnetic thermal analysis boron nitride coating |
| url | http://www.mdpi.com/1996-1073/12/1/146 |
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