Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films

Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films

Photosensitive polyimides (PSPIs) have been widely developed in microelectronics, which is due to their excellent thermal properties and reasonable dielectric properties and can be directly patterned to simplify the processing steps. In this study, 3 μm~7 μm thick PSPI films were deposited on differ...

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Bibliographic Details
Main Authors: Ruhan E. Ustad, Vijay D. Chavan, Honggyun Kim, Min-ho Shin, Sung-Kyu Kim, Kyeong-Keun Choi, Deok-kee Kim
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Nanomaterials
Subjects:
polyimide
photosensitive
Cu RDL
resistivity
advanced packaging
Online Access:https://www.mdpi.com/2079-4991/13/19/2642

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