Diffusion Barrier Prediction of Graphene and Boron Nitride for Copper Interconnects by Deep Learning
The continuous scaling-down size of interconnects should be accompanied with ultra-thin diffusion barrier layers, which is used to suppress Cu diffusion into the dielectrics. Unfortunately, conventional barrier layers with thicknesses less than 4 nm fail to perform well. With the advent of 2D layere...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2020-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9264169/ |