Comparative study of the ion-slicing mechanism of Y-cut LiNbO3

Ion-cutting of piezoelectric LiNbO3 (LN) thin film provides a material platform for the design and fabrication of novel integrated photonics and RF MEMS devices. In this paper, the ion-slicing mechanisms of He-implanted LN with different orientations are investigated. The anisotropy of film exfoliat...

Full description

Bibliographic Details
Main Authors: Kai Huang, Zhongxu Li, Youquan Yan, Xiaomeng Zhao, Wenqin Li, Tiangui You, Shibin Zhang, Hongyan Zhou, Jiajie Lin, Wenhui Xu, Ailun Yi, Hao Huang, Min Zhou, Wenjie Yu, Junyu Xie, Xiaobin Zeng, Renjie Liu, Xin Ou
Format: Article
Language:English
Published: AIP Publishing LLC 2019-08-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.5112792
_version_ 1818339829369274368
author Kai Huang
Zhongxu Li
Youquan Yan
Xiaomeng Zhao
Wenqin Li
Tiangui You
Shibin Zhang
Hongyan Zhou
Jiajie Lin
Wenhui Xu
Ailun Yi
Hao Huang
Min Zhou
Wenjie Yu
Junyu Xie
Xiaobin Zeng
Renjie Liu
Xin Ou
author_facet Kai Huang
Zhongxu Li
Youquan Yan
Xiaomeng Zhao
Wenqin Li
Tiangui You
Shibin Zhang
Hongyan Zhou
Jiajie Lin
Wenhui Xu
Ailun Yi
Hao Huang
Min Zhou
Wenjie Yu
Junyu Xie
Xiaobin Zeng
Renjie Liu
Xin Ou
author_sort Kai Huang
collection DOAJ
description Ion-cutting of piezoelectric LiNbO3 (LN) thin film provides a material platform for the design and fabrication of novel integrated photonics and RF MEMS devices. In this paper, the ion-slicing mechanisms of He-implanted LN with different orientations are investigated. The anisotropy of film exfoliation is observed on LN wafers with different orientations. The Z-cut LN shows regular surface blistering and “plate-like” exfoliation, while the Y-cut LN shows the unique “rolled-up” exfoliation. Two types of defect, i.e. the pressure-related plateau defect and the stress-related crack defect, are observed to contribute to the film exfoliation. Moreover, the defect evolution in H-implanted LN is investigated. In comparison with the He-implanted LN, implanted H ions are mainly trapped by O-H bond and the implantation-induced strain is not strong enough, which are inadequate to form the continuous crack. Therefore the H ions are not favorable for the mass production of LNOI substrates.
first_indexed 2024-12-13T15:33:13Z
format Article
id doaj.art-e6ee3f2b76d34b6ab1c11fbad8cd7c57
institution Directory Open Access Journal
issn 2158-3226
language English
last_indexed 2024-12-13T15:33:13Z
publishDate 2019-08-01
publisher AIP Publishing LLC
record_format Article
series AIP Advances
spelling doaj.art-e6ee3f2b76d34b6ab1c11fbad8cd7c572022-12-21T23:40:07ZengAIP Publishing LLCAIP Advances2158-32262019-08-0198085001085001-610.1063/1.5112792001908ADVComparative study of the ion-slicing mechanism of Y-cut LiNbO3Kai Huang0Zhongxu Li1Youquan Yan2Xiaomeng Zhao3Wenqin Li4Tiangui You5Shibin Zhang6Hongyan Zhou7Jiajie Lin8Wenhui Xu9Ailun Yi10Hao Huang11Min Zhou12Wenjie Yu13Junyu Xie14Xiaobin Zeng15Renjie Liu16Xin Ou17State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaBeijing Zhongkexin Electronics Equipment Co., Ltd, Beijing 101111, ChinaBeijing Zhongkexin Electronics Equipment Co., Ltd, Beijing 101111, ChinaShanghai Kingstone Semiconductor Joint Stock Co., Ltd, Shanghai 201399, ChinaState Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, ChinaIon-cutting of piezoelectric LiNbO3 (LN) thin film provides a material platform for the design and fabrication of novel integrated photonics and RF MEMS devices. In this paper, the ion-slicing mechanisms of He-implanted LN with different orientations are investigated. The anisotropy of film exfoliation is observed on LN wafers with different orientations. The Z-cut LN shows regular surface blistering and “plate-like” exfoliation, while the Y-cut LN shows the unique “rolled-up” exfoliation. Two types of defect, i.e. the pressure-related plateau defect and the stress-related crack defect, are observed to contribute to the film exfoliation. Moreover, the defect evolution in H-implanted LN is investigated. In comparison with the He-implanted LN, implanted H ions are mainly trapped by O-H bond and the implantation-induced strain is not strong enough, which are inadequate to form the continuous crack. Therefore the H ions are not favorable for the mass production of LNOI substrates.http://dx.doi.org/10.1063/1.5112792
spellingShingle Kai Huang
Zhongxu Li
Youquan Yan
Xiaomeng Zhao
Wenqin Li
Tiangui You
Shibin Zhang
Hongyan Zhou
Jiajie Lin
Wenhui Xu
Ailun Yi
Hao Huang
Min Zhou
Wenjie Yu
Junyu Xie
Xiaobin Zeng
Renjie Liu
Xin Ou
Comparative study of the ion-slicing mechanism of Y-cut LiNbO3
AIP Advances
title Comparative study of the ion-slicing mechanism of Y-cut LiNbO3
title_full Comparative study of the ion-slicing mechanism of Y-cut LiNbO3
title_fullStr Comparative study of the ion-slicing mechanism of Y-cut LiNbO3
title_full_unstemmed Comparative study of the ion-slicing mechanism of Y-cut LiNbO3
title_short Comparative study of the ion-slicing mechanism of Y-cut LiNbO3
title_sort comparative study of the ion slicing mechanism of y cut linbo3
url http://dx.doi.org/10.1063/1.5112792
work_keys_str_mv AT kaihuang comparativestudyoftheionslicingmechanismofycutlinbo3
AT zhongxuli comparativestudyoftheionslicingmechanismofycutlinbo3
AT youquanyan comparativestudyoftheionslicingmechanismofycutlinbo3
AT xiaomengzhao comparativestudyoftheionslicingmechanismofycutlinbo3
AT wenqinli comparativestudyoftheionslicingmechanismofycutlinbo3
AT tianguiyou comparativestudyoftheionslicingmechanismofycutlinbo3
AT shibinzhang comparativestudyoftheionslicingmechanismofycutlinbo3
AT hongyanzhou comparativestudyoftheionslicingmechanismofycutlinbo3
AT jiajielin comparativestudyoftheionslicingmechanismofycutlinbo3
AT wenhuixu comparativestudyoftheionslicingmechanismofycutlinbo3
AT ailunyi comparativestudyoftheionslicingmechanismofycutlinbo3
AT haohuang comparativestudyoftheionslicingmechanismofycutlinbo3
AT minzhou comparativestudyoftheionslicingmechanismofycutlinbo3
AT wenjieyu comparativestudyoftheionslicingmechanismofycutlinbo3
AT junyuxie comparativestudyoftheionslicingmechanismofycutlinbo3
AT xiaobinzeng comparativestudyoftheionslicingmechanismofycutlinbo3
AT renjieliu comparativestudyoftheionslicingmechanismofycutlinbo3
AT xinou comparativestudyoftheionslicingmechanismofycutlinbo3