New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints
The continuous improvement of electronic device performances and the advancement of packaging technology have brought greater challenges to the reliability of solder joints in integrated circuits (ICs). In view of the increase of chip integration and the reduction of micro-bump size in 3D ICs, the h...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-07-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127520302604 |