High-resolution printing of micrometer-scale copper electrode: From ink formulation and process optimization to application

High-resolution printing of micrometer-scale copper electrode: From ink formulation and process optimization to application

In the rapidly advancing field of electronics, there is a growing demand for devices to be miniaturized with high-resolution patterns and compact, straightforward configurations, all while maintaining cost competitiveness. Precision patterning of conductive nano ink based on inexpensive metals offer...

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Bibliographic Details
Main Authors: Jongyoun Kim, Byeongjae Kang, Hyuntae Kim, Su Hyun Choi, Jaehyoung Park, Hyeonwoo Jung, Youngjun Hwang, Sin Kwon, Kyoohee Woo, Youngu Lee
Format: Article
Language:English
Published: Elsevier 2024-01-01
Series:Journal of Materials Research and Technology
Subjects:
Copper nanoparticles
Reverse offset printing
Micropatterning
High-resolution
Thermistor microarray
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423030594

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