Etch mechanism of an Al2O3 hard mask in the Bosch process

Etch mechanism of an Al2O3 hard mask in the Bosch process

The etching of high aspect ratio structures in silicon via the Bosch process is essential in modern technologies such as microelectromechanical systems (MEMS) and through‑silicon vias (TSV) fabrication. The process can be very demanding on the mask selectivity due to long etching times, and it has b...

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Bibliographic Details
Main Authors: Martin Drost, Steffen Marschmeyer, Mirko Fraschke, Oksana Fursenko, Florian Bärwolf, Ioan Costina, Mamathamba Kalishettyhalli Mahadevaiah, Marco Lisker
Format: Article
Language:English
Published: Elsevier 2022-04-01
Series:Micro and Nano Engineering
Subjects:
Bosch process
Deep reactive ion etching
Aluminum oxide
Online Access:http://www.sciencedirect.com/science/article/pii/S259000722100023X

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