3D Heat Conductivity Model of Mold Based on Node Temperature Inheritance
A novel 3D conductive heat transfer model was developed based on node temperature inheritance. Heat transfer of the mold and billet could be analyzed synchronously. In the model, heat transfer in the copper wall was in a steady state, whereas heat transfer in the billet was in a transient state. The...
| Main Authors: | , , , , |
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| פורמט: | Article |
| שפה: | English |
| יצא לאור: |
De Gruyter
2019-02-01
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| סדרה: | High Temperature Materials and Processes |
| נושאים: | |
| גישה מקוונת: | https://doi.org/10.1515/htmp-2018-0026 |