Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloy
The hot compression bonding (HCB) in a Fe–9Cr-1.5W-0.3Ti alloy, under three conditions: (i) coarse-grained; (ii) fine-grained hot isostatic pressed (HIP); and (iii) fine-grained nano-oxide dispersion strengthened (ODS), was performed at 800 °C with strains of 10% and 30% and followed by soaking trea...
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| Format: | Article |
| Language: | English |
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Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423004799 |
| _version_ | 1797798912945291264 |
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| author | Jianqiang Wang Weifeng Liu Bin Xu Bijun Xie Sheng Liu Honglin Zhang Mingyue Sun Dianzhong Li |
| author_facet | Jianqiang Wang Weifeng Liu Bin Xu Bijun Xie Sheng Liu Honglin Zhang Mingyue Sun Dianzhong Li |
| author_sort | Jianqiang Wang |
| collection | DOAJ |
| description | The hot compression bonding (HCB) in a Fe–9Cr-1.5W-0.3Ti alloy, under three conditions: (i) coarse-grained; (ii) fine-grained hot isostatic pressed (HIP); and (iii) fine-grained nano-oxide dispersion strengthened (ODS), was performed at 800 °C with strains of 10% and 30% and followed by soaking treatment at 1000 °C for 4 h. The effects of grain size and nano-oxide particles on the interfacial microstructure evolution and healing mechanism were systematically investigated. The results showed that grain boundary bulging and small recrystallized grains formed along the straight bonding interface of the coarse-grained alloy were related to discontinuous dynamic recrystallization behavior. In contrast, a layer of fine recrystallized grains was located at the bonding interface of the fine-grained HIP alloy, which was a typical rotation dynamic recrystallization behavior. Although the interfacial recrystallization behavior of the fine-grained ODS alloy was also rotation dynamic recrystallization, nano-oxide particles inhibited interfacial recrystallization and oxide transformation. Based on the interfacial bonding ratio considering different features of HCB, the ranking of interface bonding ability was coarse-grained alloy < ODS alloy < HIP alloy. |
| first_indexed | 2024-03-13T04:10:48Z |
| format | Article |
| id | doaj.art-e94d7ce2c1324b89b0b08c324c6767eb |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-13T04:10:48Z |
| publishDate | 2023-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-e94d7ce2c1324b89b0b08c324c6767eb2023-06-21T06:55:31ZengElsevierJournal of Materials Research and Technology2238-78542023-05-0124971983Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloyJianqiang Wang0Weifeng Liu1Bin Xu2Bijun Xie3Sheng Liu4Honglin Zhang5Mingyue Sun6Dianzhong Li7School of Materials Science and Engineering, University of Science and Technology of China, Hefei 230026, China; Key Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, ChinaBeijing Institute of Technology, Chongqing Innovation Center, Chongqing, 401135, ChinaKey Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, ChinaKey Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, ChinaKey Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, ChinaKey Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, ChinaKey Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; Corresponding author.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, ChinaThe hot compression bonding (HCB) in a Fe–9Cr-1.5W-0.3Ti alloy, under three conditions: (i) coarse-grained; (ii) fine-grained hot isostatic pressed (HIP); and (iii) fine-grained nano-oxide dispersion strengthened (ODS), was performed at 800 °C with strains of 10% and 30% and followed by soaking treatment at 1000 °C for 4 h. The effects of grain size and nano-oxide particles on the interfacial microstructure evolution and healing mechanism were systematically investigated. The results showed that grain boundary bulging and small recrystallized grains formed along the straight bonding interface of the coarse-grained alloy were related to discontinuous dynamic recrystallization behavior. In contrast, a layer of fine recrystallized grains was located at the bonding interface of the fine-grained HIP alloy, which was a typical rotation dynamic recrystallization behavior. Although the interfacial recrystallization behavior of the fine-grained ODS alloy was also rotation dynamic recrystallization, nano-oxide particles inhibited interfacial recrystallization and oxide transformation. Based on the interfacial bonding ratio considering different features of HCB, the ranking of interface bonding ability was coarse-grained alloy < ODS alloy < HIP alloy.http://www.sciencedirect.com/science/article/pii/S2238785423004799Hot compression bondingGrain sizeNano-oxide particlesDynamic recrystallizationInterfacial bonding ratio |
| spellingShingle | Jianqiang Wang Weifeng Liu Bin Xu Bijun Xie Sheng Liu Honglin Zhang Mingyue Sun Dianzhong Li Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloy Journal of Materials Research and Technology Hot compression bonding Grain size Nano-oxide particles Dynamic recrystallization Interfacial bonding ratio |
| title | Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloy |
| title_full | Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloy |
| title_fullStr | Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloy |
| title_full_unstemmed | Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloy |
| title_short | Effects of grain size and nano-oxide particles on the healing mechanism of hot compression bonding Fe–9Cr-1.5W-0.3Ti alloy |
| title_sort | effects of grain size and nano oxide particles on the healing mechanism of hot compression bonding fe 9cr 1 5w 0 3ti alloy |
| topic | Hot compression bonding Grain size Nano-oxide particles Dynamic recrystallization Interfacial bonding ratio |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423004799 |
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