Laboratory High-Contrast X-ray Microscopy of Copper Nanostructures Enabled by a Liquid-Metal-Jet X-ray Source

Laboratory High-Contrast X-ray Microscopy of Copper Nanostructures Enabled by a Liquid-Metal-Jet X-ray Source

High-resolution imaging of Cu/low-k on-chip interconnect stacks in advanced microelectronic products is demonstrated using full-field transmission X-ray microscopy (TXM). The comparison of two lens-based laboratory X-ray microscopes that are operated at two different photon energies, 8.0 keV and 9.2...

Disgrifiad llawn

Manylion Llyfryddiaeth
Prif Awduron: Kristina Kutukova, Bartlomiej Lechowski, Joerg Grenzer, Peter Krueger, André Clausner, Ehrenfried Zschech
Fformat: Erthygl
Iaith:English
Cyhoeddwyd: MDPI AG 2024-02-01
Cyfres:Nanomaterials
Pynciau:
X-ray microscopy
radiography
image contrast
nanostructure
physical failure analysis
copper interconnects
Mynediad Ar-lein:https://www.mdpi.com/2079-4991/14/5/448

Rhyngrwyd

https://www.mdpi.com/2079-4991/14/5/448

Eitemau Tebyg