Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power
The thermoelectric cooler (TEC) operating under the transient mode showed a stronger short term cooling effect than that of the steady state mode. In this study, a chip cooling experimental setup with the chip modeled by a ceramic heater was constructed using a commercial Bi2Te3-based TEC. A transie...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2024-06-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X24003812 |
| _version_ | 1797203063053746176 |
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| author | Yongjia Wu Peng Zhang Sen Chen Congcong Zhi Tianhao Shi Tingrui Gong Tingzhen Ming |
| author_facet | Yongjia Wu Peng Zhang Sen Chen Congcong Zhi Tianhao Shi Tingrui Gong Tingzhen Ming |
| author_sort | Yongjia Wu |
| collection | DOAJ |
| description | The thermoelectric cooler (TEC) operating under the transient mode showed a stronger short term cooling effect than that of the steady state mode. In this study, a chip cooling experimental setup with the chip modeled by a ceramic heater was constructed using a commercial Bi2Te3-based TEC. A transient three-dimensional numerical model was established for the system optimization. The impacts of the pulse voltage amplitude, pulse voltage trigger time, pulse voltage time span, and the power magnitude of the chip on the peak temperature of the chip were analyzed in detail. The results showed that the experimental and numerical simulations were in high agreement with an error of only 3.6 %. When a pulse voltage of 12 V was applied to the TEC, the experimental results showed that the peak temperature of the chip with a pulse power of 48 W was reduced by 15.3 °C, while the simulation results demonstrated a reduction of 15.6 °C. The increase in the pulse voltage width and the pulse thermal power resulted in a larger temperature reduction. The transient cooling effect of the TEC presented a promising solution for temperature regulation in modern chips operating under dynamic power conditions. |
| first_indexed | 2024-04-24T08:13:22Z |
| format | Article |
| id | doaj.art-e9c9b66e09364c58b30b811b9342ce23 |
| institution | Directory Open Access Journal |
| issn | 2214-157X |
| language | English |
| last_indexed | 2024-04-24T08:13:22Z |
| publishDate | 2024-06-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Case Studies in Thermal Engineering |
| spelling | doaj.art-e9c9b66e09364c58b30b811b9342ce232024-04-17T04:49:12ZengElsevierCase Studies in Thermal Engineering2214-157X2024-06-0158104350Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic powerYongjia Wu0Peng Zhang1Sen Chen2Congcong Zhi3Tianhao Shi4Tingrui Gong5Tingzhen Ming6School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, China; Sanya Science and Education Innovation Park, Wuhan University of Technology, Sanya, 572024, ChinaSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaWSGRI Engineering & Surveying Incorporation Limited, Wuhan, Hubei, 430080, ChinaSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaMicrosystem & Terahertz Research Center, China Academy of Engineering Physics, Chengdu, 610200, Sichuan, ChinaSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, China; Sanya Science and Education Innovation Park, Wuhan University of Technology, Sanya, 572024, China; Corresponding author. School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, China.The thermoelectric cooler (TEC) operating under the transient mode showed a stronger short term cooling effect than that of the steady state mode. In this study, a chip cooling experimental setup with the chip modeled by a ceramic heater was constructed using a commercial Bi2Te3-based TEC. A transient three-dimensional numerical model was established for the system optimization. The impacts of the pulse voltage amplitude, pulse voltage trigger time, pulse voltage time span, and the power magnitude of the chip on the peak temperature of the chip were analyzed in detail. The results showed that the experimental and numerical simulations were in high agreement with an error of only 3.6 %. When a pulse voltage of 12 V was applied to the TEC, the experimental results showed that the peak temperature of the chip with a pulse power of 48 W was reduced by 15.3 °C, while the simulation results demonstrated a reduction of 15.6 °C. The increase in the pulse voltage width and the pulse thermal power resulted in a larger temperature reduction. The transient cooling effect of the TEC presented a promising solution for temperature regulation in modern chips operating under dynamic power conditions.http://www.sciencedirect.com/science/article/pii/S2214157X24003812Thermoelectric coolerTransient coolingTemperature controlPower chip cooling |
| spellingShingle | Yongjia Wu Peng Zhang Sen Chen Congcong Zhi Tianhao Shi Tingrui Gong Tingzhen Ming Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power Case Studies in Thermal Engineering Thermoelectric cooler Transient cooling Temperature control Power chip cooling |
| title | Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power |
| title_full | Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power |
| title_fullStr | Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power |
| title_full_unstemmed | Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power |
| title_short | Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power |
| title_sort | performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power |
| topic | Thermoelectric cooler Transient cooling Temperature control Power chip cooling |
| url | http://www.sciencedirect.com/science/article/pii/S2214157X24003812 |
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