Enhanced thermal conductivity and dielectric properties in electrostatic self-assembly 3D pBN@nCNTs fillers loaded in epoxy resin composites

Enhanced thermal conductivity and dielectric properties in electrostatic self-assembly 3D pBN@nCNTs fillers loaded in epoxy resin composites

High-performance epoxy (EP) composites with excellent thermal conductivity and dielectric properties have attracted increasing attention for effective thermal management. In this work, three-dimensional (3D) structural functional fillers were prepared by an electrostatic self-assembly approach. The...

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Bibliographic Details
Main Authors:	Dong-Li Zhang, Sheng-Nan Liu, Hui-Wu Cai, Qi-Kun Feng, Shao-Long Zhong, Jun-Wei Zha, Zhi-Min Dang
Format:	Article
Language:	English
Published:	Elsevier 2020-12-01
Series:	Journal of Materiomics
Subjects:	Thermal conductivity Dielectric permittivity Composites Electrostatic self-assembly
Online Access:	http://www.sciencedirect.com/science/article/pii/S2352847820301969

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