Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great conc...
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| Format: | Article |
| Language: | English |
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MDPI AG
2019-01-01
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| Series: | Applied Sciences |
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| Online Access: | http://www.mdpi.com/2076-3417/9/2/227 |
| _version_ | 1818907945314811904 |
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| author | Shaobin Wang Yao Yao Xu Long |
| author_facet | Shaobin Wang Yao Yao Xu Long |
| author_sort | Shaobin Wang |
| collection | DOAJ |
| description | With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great concern for the reliability of different sizes of solder interconnections. In this paper, the effect of solder size on the microstructure (i.e., interfacial intermetallic compound (IMC) growth, precipitation in the solder matrix, dendrite arms, and undercooling) and mechanical properties (i.e., tensile property, shear and compression strength, fracture toughness, and creep deformation) are reviewed from the mechanical point of view. In addition, some areas for further researches about size effects on solder joints are discussed. |
| first_indexed | 2024-12-19T22:03:11Z |
| format | Article |
| id | doaj.art-e9ec68e32c8e4c718fd08e4f189a5ba1 |
| institution | Directory Open Access Journal |
| issn | 2076-3417 |
| language | English |
| last_indexed | 2024-12-19T22:03:11Z |
| publishDate | 2019-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Sciences |
| spelling | doaj.art-e9ec68e32c8e4c718fd08e4f189a5ba12022-12-21T20:04:06ZengMDPI AGApplied Sciences2076-34172019-01-019222710.3390/app9020227app9020227Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic PackagingShaobin Wang0Yao Yao1Xu Long2School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710072, ChinaSchool of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710072, ChinaSchool of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710072, ChinaWith the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great concern for the reliability of different sizes of solder interconnections. In this paper, the effect of solder size on the microstructure (i.e., interfacial intermetallic compound (IMC) growth, precipitation in the solder matrix, dendrite arms, and undercooling) and mechanical properties (i.e., tensile property, shear and compression strength, fracture toughness, and creep deformation) are reviewed from the mechanical point of view. In addition, some areas for further researches about size effects on solder joints are discussed.http://www.mdpi.com/2076-3417/9/2/227size effectmicrostructuremechanical propertysolder joint |
| spellingShingle | Shaobin Wang Yao Yao Xu Long Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging Applied Sciences size effect microstructure mechanical property solder joint |
| title | Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging |
| title_full | Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging |
| title_fullStr | Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging |
| title_full_unstemmed | Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging |
| title_short | Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging |
| title_sort | critical review of size effects on microstructure and mechanical properties of solder joints for electronic packaging |
| topic | size effect microstructure mechanical property solder joint |
| url | http://www.mdpi.com/2076-3417/9/2/227 |
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