Design and implementation of microsystem based on SiP technology
The SiP(System in Package) is introduced. Based on the SiP technology,a microsystem composed of bare dies such as FPGA，ARM，SRAM is designed. The working principle of microsystem is introduced，and the implementation process of the product is described. The system has the characteristics of light weig...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2018-12-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000094719 |
| _version_ | 1818615248460972032 |
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| author | Wang Fuxin Guo Fengjuan Niu Yucheng Zhan Xinglong |
| author_facet | Wang Fuxin Guo Fengjuan Niu Yucheng Zhan Xinglong |
| author_sort | Wang Fuxin |
| collection | DOAJ |
| description | The SiP(System in Package) is introduced. Based on the SiP technology,a microsystem composed of bare dies such as FPGA，ARM，SRAM is designed. The working principle of microsystem is introduced，and the implementation process of the product is described. The system has the characteristics of light weight,small volume and complete function. |
| first_indexed | 2024-12-16T16:30:53Z |
| format | Article |
| id | doaj.art-e9fd4c9faa2c479296bcbae934a2c812 |
| institution | Directory Open Access Journal |
| issn | 0258-7998 |
| language | zho |
| last_indexed | 2024-12-16T16:30:53Z |
| publishDate | 2018-12-01 |
| publisher | National Computer System Engineering Research Institute of China |
| record_format | Article |
| series | Dianzi Jishu Yingyong |
| spelling | doaj.art-e9fd4c9faa2c479296bcbae934a2c8122022-12-21T22:24:36ZzhoNational Computer System Engineering Research Institute of ChinaDianzi Jishu Yingyong0258-79982018-12-014412171910.16157/j.issn.0258-7998.1811393000094719Design and implementation of microsystem based on SiP technologyWang Fuxin0Guo Fengjuan1Niu Yucheng2Zhan Xinglong3Shandong Institute of Space Electronic Technology，Yantai 264003，ChinaShandong Institute of Space Electronic Technology，Yantai 264003，ChinaShandong Institute of Space Electronic Technology，Yantai 264003，ChinaShandong Institute of Space Electronic Technology，Yantai 264003，ChinaThe SiP(System in Package) is introduced. Based on the SiP technology,a microsystem composed of bare dies such as FPGA，ARM，SRAM is designed. The working principle of microsystem is introduced，and the implementation process of the product is described. The system has the characteristics of light weight,small volume and complete function.http://www.chinaaet.com/article/3000094719SiPbare diemicrosystem |
| spellingShingle | Wang Fuxin Guo Fengjuan Niu Yucheng Zhan Xinglong Design and implementation of microsystem based on SiP technology Dianzi Jishu Yingyong SiP bare die microsystem |
| title | Design and implementation of microsystem based on SiP technology |
| title_full | Design and implementation of microsystem based on SiP technology |
| title_fullStr | Design and implementation of microsystem based on SiP technology |
| title_full_unstemmed | Design and implementation of microsystem based on SiP technology |
| title_short | Design and implementation of microsystem based on SiP technology |
| title_sort | design and implementation of microsystem based on sip technology |
| topic | SiP bare die microsystem |
| url | http://www.chinaaet.com/article/3000094719 |
| work_keys_str_mv | AT wangfuxin designandimplementationofmicrosystembasedonsiptechnology AT guofengjuan designandimplementationofmicrosystembasedonsiptechnology AT niuyucheng designandimplementationofmicrosystembasedonsiptechnology AT zhanxinglong designandimplementationofmicrosystembasedonsiptechnology |