Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications
Abstract Continuous microcorrugation processes have been developed to form long vertical wavy structures of copper (Cu) foil electrodes for the development of long stretchable interconnects of wearable devices and electronic textiles. Vertical wavy stretchable interconnects in previous studies suffe...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2020-03-01
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| Series: | Engineering Reports |
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| Online Access: | https://doi.org/10.1002/eng2.12143 |
| _version_ | 1831759162089930752 |
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| author | Michitaka Yamamoto Ryu Karasawa Shinji Okuda Seiichi Takamatsu Toshihiro Itoh |
| author_facet | Michitaka Yamamoto Ryu Karasawa Shinji Okuda Seiichi Takamatsu Toshihiro Itoh |
| author_sort | Michitaka Yamamoto |
| collection | DOAJ |
| description | Abstract Continuous microcorrugation processes have been developed to form long vertical wavy structures of copper (Cu) foil electrodes for the development of long stretchable interconnects of wearable devices and electronic textiles. Vertical wavy stretchable interconnects in previous studies suffer from low uniformity and limited size due to their wrinkling process with prestretched rubber substrate. Therefore, we propose a continuous metal foil forming process where a long flat Cu foil is continuously deformed into a wavy shape between two three‐dimensional printed gears. 5‐μm Cu foils were corrugated into a wavy structure with waves having 620‐μm pitch and 270‐μm height by the microcorrugation process. The fabricated wavy Cu interconnects showed a 40% stretchability. After microcorrugation, the interconnects were embedded in silicone rubber to protect them from mechanical scratch and improve their elasticity. The interconnects exhibited a 60% stretchability. Finally, a 25 cm‐long stretchable light emitting diodes (LEDs) ribbon with a stretchability over 20% was demonstrated by connecting the LEDs with our wavy Cu interconnects for electronic textile applications. The results demonstrate the effectiveness of our microcorrugation process in the fabrication of long uniform vertical interconnects. |
| first_indexed | 2024-12-22T01:01:25Z |
| format | Article |
| id | doaj.art-ea25b18da1a44145b10e3bc7279ae2fa |
| institution | Directory Open Access Journal |
| issn | 2577-8196 |
| language | English |
| last_indexed | 2024-12-22T01:01:25Z |
| publishDate | 2020-03-01 |
| publisher | Wiley |
| record_format | Article |
| series | Engineering Reports |
| spelling | doaj.art-ea25b18da1a44145b10e3bc7279ae2fa2022-12-21T18:44:11ZengWileyEngineering Reports2577-81962020-03-0123n/an/a10.1002/eng2.12143Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applicationsMichitaka Yamamoto0Ryu Karasawa1Shinji Okuda2Seiichi Takamatsu3Toshihiro Itoh4Department of Human and Engineered Environmental Studies The University of Tokyo, Graduate School of Frontier Sciences Kashiwa JapanDepartment of Human and Engineered Environmental Studies The University of Tokyo, Graduate School of Frontier Sciences Kashiwa JapanDepartment of Human and Engineered Environmental Studies The University of Tokyo, Graduate School of Frontier Sciences Kashiwa JapanDepartment of Human and Engineered Environmental Studies The University of Tokyo, Graduate School of Frontier Sciences Kashiwa JapanDepartment of Human and Engineered Environmental Studies The University of Tokyo, Graduate School of Frontier Sciences Kashiwa JapanAbstract Continuous microcorrugation processes have been developed to form long vertical wavy structures of copper (Cu) foil electrodes for the development of long stretchable interconnects of wearable devices and electronic textiles. Vertical wavy stretchable interconnects in previous studies suffer from low uniformity and limited size due to their wrinkling process with prestretched rubber substrate. Therefore, we propose a continuous metal foil forming process where a long flat Cu foil is continuously deformed into a wavy shape between two three‐dimensional printed gears. 5‐μm Cu foils were corrugated into a wavy structure with waves having 620‐μm pitch and 270‐μm height by the microcorrugation process. The fabricated wavy Cu interconnects showed a 40% stretchability. After microcorrugation, the interconnects were embedded in silicone rubber to protect them from mechanical scratch and improve their elasticity. The interconnects exhibited a 60% stretchability. Finally, a 25 cm‐long stretchable light emitting diodes (LEDs) ribbon with a stretchability over 20% was demonstrated by connecting the LEDs with our wavy Cu interconnects for electronic textile applications. The results demonstrate the effectiveness of our microcorrugation process in the fabrication of long uniform vertical interconnects.https://doi.org/10.1002/eng2.12143Cu foilmicrocorrugation processstretchable interconnects |
| spellingShingle | Michitaka Yamamoto Ryu Karasawa Shinji Okuda Seiichi Takamatsu Toshihiro Itoh Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications Engineering Reports Cu foil microcorrugation process stretchable interconnects |
| title | Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications |
| title_full | Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications |
| title_fullStr | Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications |
| title_full_unstemmed | Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications |
| title_short | Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications |
| title_sort | long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications |
| topic | Cu foil microcorrugation process stretchable interconnects |
| url | https://doi.org/10.1002/eng2.12143 |
| work_keys_str_mv | AT michitakayamamoto longwavycopperstretchableinterconnectsfabricatedbycontinuousmicrocorrugationprocessforwearableapplications AT ryukarasawa longwavycopperstretchableinterconnectsfabricatedbycontinuousmicrocorrugationprocessforwearableapplications AT shinjiokuda longwavycopperstretchableinterconnectsfabricatedbycontinuousmicrocorrugationprocessforwearableapplications AT seiichitakamatsu longwavycopperstretchableinterconnectsfabricatedbycontinuousmicrocorrugationprocessforwearableapplications AT toshihiroitoh longwavycopperstretchableinterconnectsfabricatedbycontinuousmicrocorrugationprocessforwearableapplications |