Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications
Abstract Continuous microcorrugation processes have been developed to form long vertical wavy structures of copper (Cu) foil electrodes for the development of long stretchable interconnects of wearable devices and electronic textiles. Vertical wavy stretchable interconnects in previous studies suffe...
Main Authors: | Michitaka Yamamoto, Ryu Karasawa, Shinji Okuda, Seiichi Takamatsu, Toshihiro Itoh |
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Format: | Article |
Language: | English |
Published: |
Wiley
2020-03-01
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Series: | Engineering Reports |
Subjects: | |
Online Access: | https://doi.org/10.1002/eng2.12143 |
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