Long wavy copper stretchable interconnects fabricated by continuous microcorrugation process for wearable applications

Abstract Continuous microcorrugation processes have been developed to form long vertical wavy structures of copper (Cu) foil electrodes for the development of long stretchable interconnects of wearable devices and electronic textiles. Vertical wavy stretchable interconnects in previous studies suffe...

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書目詳細資料
Main Authors: Michitaka Yamamoto, Ryu Karasawa, Shinji Okuda, Seiichi Takamatsu, Toshihiro Itoh
格式: Article
語言:English
出版: Wiley 2020-03-01
叢編:Engineering Reports
主題:
在線閱讀:https://doi.org/10.1002/eng2.12143