Experimental Investigation on the In-Plane Creep Behavior of a Carbon-Fiber Sheet Molding Compound at Elevated Temperature at Different Stress States

The creepage behavior of one thermosetting carbon fiber sheet molding compound (SMC) material was studied applying in-plane loading at 120 °C. Loads were applied in bending, tension and compression test setups at the same in-plane stress level of 47 MPa. Different creep strain rates were determined....

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Main Authors: David Finck, Christian Seidel, Anika Ostermeier, Joachim Hausmann, Thomas Rief
Format: Article
Language:English
Published: MDPI AG 2020-06-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/13/11/2545
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author David Finck
Christian Seidel
Anika Ostermeier
Joachim Hausmann
Thomas Rief
author_facet David Finck
Christian Seidel
Anika Ostermeier
Joachim Hausmann
Thomas Rief
author_sort David Finck
collection DOAJ
description The creepage behavior of one thermosetting carbon fiber sheet molding compound (SMC) material was studied applying in-plane loading at 120 °C. Loads were applied in bending, tension and compression test setups at the same in-plane stress level of 47 MPa. Different creep strain rates were determined. The creep strain rate in flexural loading was significantly higher than in tensile loading. The test specimens in compression loading collapsed within minutes and no findings regarding the creep strain rates were possible. Overall, it was observed that the thermosetting press resin of this industrially used material had only little creep load bearing capacity at the mentioned temperature when loaded in mixed stress states. The test data has high usage for estimating design limits of structural loaded SMC components at elevated temperature.
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spelling doaj.art-eaeb4a7ff1d642b3965a8ccdf3ff95a32023-11-20T02:43:52ZengMDPI AGMaterials1996-19442020-06-011311254510.3390/ma13112545Experimental Investigation on the In-Plane Creep Behavior of a Carbon-Fiber Sheet Molding Compound at Elevated Temperature at Different Stress StatesDavid Finck0Christian Seidel1Anika Ostermeier2Joachim Hausmann3Thomas Rief4SIEMENS AG, Corporate Technology REE MDM POL-DE, 91058 Erlangen, GermanySIEMENS AG, Corporate Technology REE MDM POL-DE, 91058 Erlangen, GermanySIEMENS AG, Corporate Technology REE MDM POL-DE, 91058 Erlangen, GermanyIVW—Institute for Composite Materials GmbH, Component Development, 67663 Kaiserslautern, GermanyIVW—Institute for Composite Materials GmbH, Component Development, 67663 Kaiserslautern, GermanyThe creepage behavior of one thermosetting carbon fiber sheet molding compound (SMC) material was studied applying in-plane loading at 120 °C. Loads were applied in bending, tension and compression test setups at the same in-plane stress level of 47 MPa. Different creep strain rates were determined. The creep strain rate in flexural loading was significantly higher than in tensile loading. The test specimens in compression loading collapsed within minutes and no findings regarding the creep strain rates were possible. Overall, it was observed that the thermosetting press resin of this industrially used material had only little creep load bearing capacity at the mentioned temperature when loaded in mixed stress states. The test data has high usage for estimating design limits of structural loaded SMC components at elevated temperature.https://www.mdpi.com/1996-1944/13/11/2545creeprelaxationcompositessheet molding compoundSMC
spellingShingle David Finck
Christian Seidel
Anika Ostermeier
Joachim Hausmann
Thomas Rief
Experimental Investigation on the In-Plane Creep Behavior of a Carbon-Fiber Sheet Molding Compound at Elevated Temperature at Different Stress States
Materials
creep
relaxation
composites
sheet molding compound
SMC
title Experimental Investigation on the In-Plane Creep Behavior of a Carbon-Fiber Sheet Molding Compound at Elevated Temperature at Different Stress States
title_full Experimental Investigation on the In-Plane Creep Behavior of a Carbon-Fiber Sheet Molding Compound at Elevated Temperature at Different Stress States
title_fullStr Experimental Investigation on the In-Plane Creep Behavior of a Carbon-Fiber Sheet Molding Compound at Elevated Temperature at Different Stress States
title_full_unstemmed Experimental Investigation on the In-Plane Creep Behavior of a Carbon-Fiber Sheet Molding Compound at Elevated Temperature at Different Stress States
title_short Experimental Investigation on the In-Plane Creep Behavior of a Carbon-Fiber Sheet Molding Compound at Elevated Temperature at Different Stress States
title_sort experimental investigation on the in plane creep behavior of a carbon fiber sheet molding compound at elevated temperature at different stress states
topic creep
relaxation
composites
sheet molding compound
SMC
url https://www.mdpi.com/1996-1944/13/11/2545
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