Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices
Optically clear adhesive (OCA) has been widely used in flexible devices, where wavy stripes that cause troublesome long-term reliability problems often occur. The complex mechanical behavior of OCA should be studied, as it is related to the aforementioned problems. Therefore, it is necessary to esta...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-02-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/2/301 |
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| author | Yuexin Zhang Shizhao Wang Fang Dong Yameng Sun Can Sheng Kun Ma Zhiqiang Tian Zhengfang Qian Chingping Wong Sheng Liu |
| author_facet | Yuexin Zhang Shizhao Wang Fang Dong Yameng Sun Can Sheng Kun Ma Zhiqiang Tian Zhengfang Qian Chingping Wong Sheng Liu |
| author_sort | Yuexin Zhang |
| collection | DOAJ |
| description | Optically clear adhesive (OCA) has been widely used in flexible devices, where wavy stripes that cause troublesome long-term reliability problems often occur. The complex mechanical behavior of OCA should be studied, as it is related to the aforementioned problems. Therefore, it is necessary to establish reasonable mechanical constitutive models for deformation and stress control. In this work, hyperelastic and viscoelastic mechanical tests were carried out systematically and relative constitutive models of OCA material were established. We found that temperature has a great influence on OCA’s mechanical properties. The stress and modulus both decreased rapidly as the temperature increased. In the static viscoelasticity test, the initial stress at 85 °C was only 12.6 kPa, 57.4% lower than the initial stress at 30 °C. However, in the dynamic test, the storage modulus monotonically decreased from 1666.3 MPa to 0.6628 MPa as the temperature rose, and the decline rate reached the maximum near the glass transition temperature (<i>T<sub>g</sub></i> = 0 °C). The test data and constitutive models can be used as design references in the manufacturing process, as well as for product reliability evaluation. |
| first_indexed | 2024-03-09T21:25:08Z |
| format | Article |
| id | doaj.art-eaf1bbcae150450abe6cb18d23ddd54c |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T21:25:08Z |
| publishDate | 2022-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-eaf1bbcae150450abe6cb18d23ddd54c2023-11-23T21:11:45ZengMDPI AGMicromachines2072-666X2022-02-0113230110.3390/mi13020301Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible DevicesYuexin Zhang0Shizhao Wang1Fang Dong2Yameng Sun3Can Sheng4Kun Ma5Zhiqiang Tian6Zhengfang Qian7Chingping Wong8Sheng Liu9School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaThe Institute of Technological Sciences, Wuhan University, Wuhan 430072, ChinaThe Institute of Technological Sciences, Wuhan University, Wuhan 430072, ChinaSchool of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, ChinaThe Institute of Technological Sciences, Wuhan University, Wuhan 430072, ChinaSchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaCollege of Physics and Optoelectronic Engineering, Shenzhen University, Shenzhen 518060, ChinaSchool of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USASchool of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, ChinaOptically clear adhesive (OCA) has been widely used in flexible devices, where wavy stripes that cause troublesome long-term reliability problems often occur. The complex mechanical behavior of OCA should be studied, as it is related to the aforementioned problems. Therefore, it is necessary to establish reasonable mechanical constitutive models for deformation and stress control. In this work, hyperelastic and viscoelastic mechanical tests were carried out systematically and relative constitutive models of OCA material were established. We found that temperature has a great influence on OCA’s mechanical properties. The stress and modulus both decreased rapidly as the temperature increased. In the static viscoelasticity test, the initial stress at 85 °C was only 12.6 kPa, 57.4% lower than the initial stress at 30 °C. However, in the dynamic test, the storage modulus monotonically decreased from 1666.3 MPa to 0.6628 MPa as the temperature rose, and the decline rate reached the maximum near the glass transition temperature (<i>T<sub>g</sub></i> = 0 °C). The test data and constitutive models can be used as design references in the manufacturing process, as well as for product reliability evaluation.https://www.mdpi.com/2072-666X/13/2/301flexible devicesviscoelastichyperelasticmechanical constitutive model |
| spellingShingle | Yuexin Zhang Shizhao Wang Fang Dong Yameng Sun Can Sheng Kun Ma Zhiqiang Tian Zhengfang Qian Chingping Wong Sheng Liu Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices Micromachines flexible devices viscoelastic hyperelastic mechanical constitutive model |
| title | Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices |
| title_full | Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices |
| title_fullStr | Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices |
| title_full_unstemmed | Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices |
| title_short | Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices |
| title_sort | mechanical behavior and constitutive model characterization of optically clear adhesive in flexible devices |
| topic | flexible devices viscoelastic hyperelastic mechanical constitutive model |
| url | https://www.mdpi.com/2072-666X/13/2/301 |
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