The Interaction between He Bubble and Migrating Grain Boundary Induced by Shear Loading
This work reveals the interaction mechanism between He bubble and grain boundary (GB) in bicrystal copper under shear loading via molecular dynamics simulations. The influences of He/vacancy ratio R<sub>He/V</sub>, temperature T<sub>0</sub>, and bubble diameter D<sub>0&...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-11-01
|
| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/12/12/2012 |