In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography
Synchrotron radiation dynamic imaging technology combined with the static characterization method was used to study the microstructural evolution and the growth kinetics of intermetallic compounds (IMCs) at the liquid Al/solid Cu interface. The results show that the interfacial microstructure can be...
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MDPI AG
2022-08-01
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| Online Access: | https://www.mdpi.com/1996-1944/15/16/5647 |
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| author | Fei Cao Ruosi Wang Peng Zhang Tongmin Wang Kexing Song |
| author_facet | Fei Cao Ruosi Wang Peng Zhang Tongmin Wang Kexing Song |
| author_sort | Fei Cao |
| collection | DOAJ |
| description | Synchrotron radiation dynamic imaging technology combined with the static characterization method was used to study the microstructural evolution and the growth kinetics of intermetallic compounds (IMCs) at the liquid Al/solid Cu interface. The results show that the interfacial microstructure can be divided into layered solid diffusion microstructures (AlCu<sub>3</sub>, Al<sub>4</sub>Cu<sub>9</sub>, Al<sub>2</sub>Cu<sub>3</sub> and AlCu) and solidification microstructures (Al<sub>3</sub>Cu<sub>4</sub>, AlCu and Al<sub>2</sub>Cu) from the Cu side to the Al side. Meanwhile, the growth of bubbles formed during the melting, holding and solidification of an Al/Cu sample was also discussed, which can be divided into three modes: diffusion, coalescence and engulfment. Moreover, the growth of AlCu<sub>3</sub> and (Al<sub>4</sub>Cu<sub>9</sub> + Al<sub>2</sub>Cu<sub>3</sub>) near the Cu side is all controlled by both interfacial reaction and volume diffusion. The growth of Al<sub>3</sub>Cu<sub>4</sub> adjacent to the melt is mainly controlled by the interfacial reaction, which plays a major role in the growth of the total IMCs. |
| first_indexed | 2024-03-09T09:53:22Z |
| format | Article |
| id | doaj.art-eb53b317634c406c87d3ff5291f508bf |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-09T09:53:22Z |
| publishDate | 2022-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-eb53b317634c406c87d3ff5291f508bf2023-12-01T23:56:34ZengMDPI AGMaterials1996-19442022-08-011516564710.3390/ma15165647In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray RadiographyFei Cao0Ruosi Wang1Peng Zhang2Tongmin Wang3Kexing Song4Shaanxi Province Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, ChinaShaanxi Province Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, ChinaShaanxi Province Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, ChinaSchool of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, ChinaSynchrotron radiation dynamic imaging technology combined with the static characterization method was used to study the microstructural evolution and the growth kinetics of intermetallic compounds (IMCs) at the liquid Al/solid Cu interface. The results show that the interfacial microstructure can be divided into layered solid diffusion microstructures (AlCu<sub>3</sub>, Al<sub>4</sub>Cu<sub>9</sub>, Al<sub>2</sub>Cu<sub>3</sub> and AlCu) and solidification microstructures (Al<sub>3</sub>Cu<sub>4</sub>, AlCu and Al<sub>2</sub>Cu) from the Cu side to the Al side. Meanwhile, the growth of bubbles formed during the melting, holding and solidification of an Al/Cu sample was also discussed, which can be divided into three modes: diffusion, coalescence and engulfment. Moreover, the growth of AlCu<sub>3</sub> and (Al<sub>4</sub>Cu<sub>9</sub> + Al<sub>2</sub>Cu<sub>3</sub>) near the Cu side is all controlled by both interfacial reaction and volume diffusion. The growth of Al<sub>3</sub>Cu<sub>4</sub> adjacent to the melt is mainly controlled by the interfacial reaction, which plays a major role in the growth of the total IMCs.https://www.mdpi.com/1996-1944/15/16/5647liquid Al/solid Cu interfacebubble growthintermetallic compoundsmicrostructuresynchrotron X-ray radiography |
| spellingShingle | Fei Cao Ruosi Wang Peng Zhang Tongmin Wang Kexing Song In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography Materials liquid Al/solid Cu interface bubble growth intermetallic compounds microstructure synchrotron X-ray radiography |
| title | In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography |
| title_full | In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography |
| title_fullStr | In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography |
| title_full_unstemmed | In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography |
| title_short | In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography |
| title_sort | in situ investigation of microstructural evolution and intermetallic compounds formation at liquid al solid cu interface by synchrotron x ray radiography |
| topic | liquid Al/solid Cu interface bubble growth intermetallic compounds microstructure synchrotron X-ray radiography |
| url | https://www.mdpi.com/1996-1944/15/16/5647 |
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