Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis
We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was c...
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| Format: | Article |
| Language: | English |
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MDPI AG
2021-05-01
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| Series: | Polymers |
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| Online Access: | https://www.mdpi.com/2073-4360/13/11/1734 |
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| author | Erick Franieck Martin Fleischmann Ole Hölck Larysa Kutuzova Andreas Kandelbauer |
| author_facet | Erick Franieck Martin Fleischmann Ole Hölck Larysa Kutuzova Andreas Kandelbauer |
| author_sort | Erick Franieck |
| collection | DOAJ |
| description | We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production. |
| first_indexed | 2024-03-10T11:02:57Z |
| format | Article |
| id | doaj.art-ebce18082f1f4e15a812bf0d34bbd92d |
| institution | Directory Open Access Journal |
| issn | 2073-4360 |
| language | English |
| last_indexed | 2024-03-10T11:02:57Z |
| publishDate | 2021-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Polymers |
| spelling | doaj.art-ebce18082f1f4e15a812bf0d34bbd92d2023-11-21T21:24:57ZengMDPI AGPolymers2073-43602021-05-011311173410.3390/polym13111734Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric AnalysisErick Franieck0Martin Fleischmann1Ole Hölck2Larysa Kutuzova3Andreas Kandelbauer4Automotive Electronics, Engineering Technology Polymer & Packaging, Robert Bosch GmbH, 72770 Reutlingen, GermanyAutomotive Electronics, Engineering Technology Polymer & Packaging, Robert Bosch GmbH, 72770 Reutlingen, GermanySystem Integration and Interconnections Technologies, Fraunhofer IZM, 10623 Berlin, GermanyCenter for Process Analysis & Technology (PA&T), School of Applied Chemistry, Reutlingen University, Alteburgstrasse 150, 72762 Reutlingen, GermanyCenter for Process Analysis & Technology (PA&T), School of Applied Chemistry, Reutlingen University, Alteburgstrasse 150, 72762 Reutlingen, GermanyWe report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was cured under isothermal temperatures close to general process conditions (165–185 °C). The material conversion was determined by measuring the ion viscosity. The change of the ion viscosity as a function of time and temperature was used to characterize the cross-linking behavior, following two separate approaches (model based and isoconversional). The determined kinetic parameters are in good agreement with those reported in the literature for EMCs and lead to accurate cure predictions under process-near conditions. Furthermore, the kinetic models based on dielectric analysis (DEA) were compared with standard offline differential scanning calorimetry (DSC) models, which were based on dynamic measurements. Many of the determined kinetic parameters had similar values for the different approaches. Major deviations were found for the parameters linked to the end of the reaction where vitrification phenomena occur under process-related conditions. The glass transition temperature of the inline molded parts was determined via thermomechanical analysis (TMA) to confirm the vitrification effect. The similarities and differences between the resulting kinetics models of the two different measurement techniques are presented and it is shown how dielectric analysis can be of high relevance for the characterization of the curing reaction under conditions close to series production.https://www.mdpi.com/2073-4360/13/11/1734dielectric analysis (DEA)differential scanning calorimetry (DSC)thermomechanical analysis (TMA)kineticsepoxy molding compound (EMC)inline analytics |
| spellingShingle | Erick Franieck Martin Fleischmann Ole Hölck Larysa Kutuzova Andreas Kandelbauer Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis Polymers dielectric analysis (DEA) differential scanning calorimetry (DSC) thermomechanical analysis (TMA) kinetics epoxy molding compound (EMC) inline analytics |
| title | Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis |
| title_full | Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis |
| title_fullStr | Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis |
| title_full_unstemmed | Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis |
| title_short | Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis |
| title_sort | cure kinetics modeling of a high glass transition temperature epoxy molding compound emc based on inline dielectric analysis |
| topic | dielectric analysis (DEA) differential scanning calorimetry (DSC) thermomechanical analysis (TMA) kinetics epoxy molding compound (EMC) inline analytics |
| url | https://www.mdpi.com/2073-4360/13/11/1734 |
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