Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis
We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct packaging of electronic components. The resin was c...
Main Authors: | Erick Franieck, Martin Fleischmann, Ole Hölck, Larysa Kutuzova, Andreas Kandelbauer |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-05-01
|
Series: | Polymers |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4360/13/11/1734 |
Similar Items
-
Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC
by: Shuang Yan, et al.
Published: (2021-09-01) -
Usage of Near-Infrared Spectroscopy for Inline Monitoring the Degree of Curing in RTM Processes
by: Moritz Salzmann, et al.
Published: (2021-09-01) -
Thermal Analyse sof Cross-Linked Polyethylene
by: Radek Polansky
Published: (2007-01-01) -
Thermomechanical analysis (TMA) of vitrimers
by: Amber M. Hubbard, et al.
Published: (2023-01-01) -
Characterization of Nanocomposites by Thermal Analysis
by: Mariaenrica Frigione, et al.
Published: (2012-12-01)