Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping
Electromigration (EM) mechanisms are well studied in damascene copper lines capped with inorganic dielectrics. However, EM in Cu redistribution lines (RDLs) capped by organic layers is not well-understood. In this study, nanotwinned copper (nt-Cu) is adopted, which has high mechanical strength as we...
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| Format: | Article |
| Language: | English |
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Elsevier
2021-05-01
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| Series: | Results in Physics |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379721003065 |
| _version_ | 1818641734763020288 |
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| author | I-Hsin Tseng Po-Ning Hsu Tien-Lin Lu K.N. Tu Chih Chen |
| author_facet | I-Hsin Tseng Po-Ning Hsu Tien-Lin Lu K.N. Tu Chih Chen |
| author_sort | I-Hsin Tseng |
| collection | DOAJ |
| description | Electromigration (EM) mechanisms are well studied in damascene copper lines capped with inorganic dielectrics. However, EM in Cu redistribution lines (RDLs) capped by organic layers is not well-understood. In this study, nanotwinned copper (nt-Cu) is adopted, which has high mechanical strength as well as excellent electrical resistivity. We designed EM test vehicles with four-point probes to measure the lifetime of RDLs and examine the failure mechanisms of the Cu RDLs. The length of the RDLs was 800 µm, the width was 10 µm, and the height was 5 µm. The samples were tested at 200 °C, with current densities of 1.0 × 106 A/cm2. The results indicated that there were two main failure mechanisms, including EM-induced voiding and oxidation of Cu RDLs. The measured EM lifetime of nt-Cu RDLs is 4 times longer than that of regular Cu RDLs. |
| first_indexed | 2024-12-16T23:31:53Z |
| format | Article |
| id | doaj.art-ebe38cde3cd04b64a61b39ae6f088d2c |
| institution | Directory Open Access Journal |
| issn | 2211-3797 |
| language | English |
| last_indexed | 2024-12-16T23:31:53Z |
| publishDate | 2021-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Physics |
| spelling | doaj.art-ebe38cde3cd04b64a61b39ae6f088d2c2022-12-21T22:11:52ZengElsevierResults in Physics2211-37972021-05-0124104154Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide cappingI-Hsin Tseng0Po-Ning Hsu1Tien-Lin Lu2K.N. Tu3Chih Chen4Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan, ROC; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan, ROCDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan, ROC; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan, ROCDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan, ROC; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan, ROCInternational College of Semiconductor Technology, National Chiao Tung University, Hsinchu 30010, Taiwan, ROC; Department of Materials Science and Engineering, UCLA, Los Angeles, CA, USADepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan, ROC; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan, ROC; Corresponding author.Electromigration (EM) mechanisms are well studied in damascene copper lines capped with inorganic dielectrics. However, EM in Cu redistribution lines (RDLs) capped by organic layers is not well-understood. In this study, nanotwinned copper (nt-Cu) is adopted, which has high mechanical strength as well as excellent electrical resistivity. We designed EM test vehicles with four-point probes to measure the lifetime of RDLs and examine the failure mechanisms of the Cu RDLs. The length of the RDLs was 800 µm, the width was 10 µm, and the height was 5 µm. The samples were tested at 200 °C, with current densities of 1.0 × 106 A/cm2. The results indicated that there were two main failure mechanisms, including EM-induced voiding and oxidation of Cu RDLs. The measured EM lifetime of nt-Cu RDLs is 4 times longer than that of regular Cu RDLs.http://www.sciencedirect.com/science/article/pii/S2211379721003065Organic materialsnanotwinned CuElectromigrationOxidationRDLs |
| spellingShingle | I-Hsin Tseng Po-Ning Hsu Tien-Lin Lu K.N. Tu Chih Chen Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping Results in Physics Organic materials nanotwinned Cu Electromigration Oxidation RDLs |
| title | Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping |
| title_full | Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping |
| title_fullStr | Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping |
| title_full_unstemmed | Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping |
| title_short | Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping |
| title_sort | electromigration failure mechanisms of 111 oriented nanotwinned cu redistribution lines with polyimide capping |
| topic | Organic materials nanotwinned Cu Electromigration Oxidation RDLs |
| url | http://www.sciencedirect.com/science/article/pii/S2211379721003065 |
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