Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping
Electromigration (EM) mechanisms are well studied in damascene copper lines capped with inorganic dielectrics. However, EM in Cu redistribution lines (RDLs) capped by organic layers is not well-understood. In this study, nanotwinned copper (nt-Cu) is adopted, which has high mechanical strength as we...
Main Authors: | I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu, K.N. Tu, Chih Chen |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2021-05-01
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Series: | Results in Physics |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379721003065 |
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