Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping
Electromigration (EM) mechanisms are well studied in damascene copper lines capped with inorganic dielectrics. However, EM in Cu redistribution lines (RDLs) capped by organic layers is not well-understood. In this study, nanotwinned copper (nt-Cu) is adopted, which has high mechanical strength as we...
Main Authors: | I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu, K.N. Tu, Chih Chen |
---|---|
Format: | Article |
Language: | English |
Published: |
Elsevier
2021-05-01
|
Series: | Results in Physics |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379721003065 |
Similar Items
-
A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu
by: Jing-Ye Juang, et al.
Published: (2021-09-01) -
Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect
by: Shih-Chi Yang, et al.
Published: (2024-11-01) -
A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions
by: Gangli Yang, et al.
Published: (2024-11-01) -
Electromigration-Aware Architecture for Modern Microprocessors
by: Freddy Gabbay, et al.
Published: (2023-01-01) -
Anisotropic deformation mechanisms in textured nanotwined Cu under shock loading
by: Caihong Hou, et al.
Published: (2023-11-01)