Electromigration failure mechanisms of 〈111〉 -oriented nanotwinned Cu redistribution lines with polyimide capping

Electromigration (EM) mechanisms are well studied in damascene copper lines capped with inorganic dielectrics. However, EM in Cu redistribution lines (RDLs) capped by organic layers is not well-understood. In this study, nanotwinned copper (nt-Cu) is adopted, which has high mechanical strength as we...

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Bibliographic Details
Main Authors: I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu, K.N. Tu, Chih Chen
Format: Article
Language:English
Published: Elsevier 2021-05-01
Series:Results in Physics
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2211379721003065

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