Dual-Frequency RF Impedance Matching Circuits for Semiconductor Plasma Etch Equipment
The change in electrode impedance of semiconductor equipment due to repetitive processes is a major issue that creates process drift. In the current plasma etch chamber with a dual-frequency power system, the high-powered radio frequency (RF) source contributes to the enhancement of the plasma densi...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-08-01
|
| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/10/17/2074 |