PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes

To increase the reliability of the printed circuit board (PCB) manufacturing process, automated optical inspection is often employed for soldering defect detection. However, traditional approaches built on handcrafted features, predefined rules, or thresholds are often susceptible to the variation o...

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Main Authors: Sik-Ho Tsang, Zhaoqing Suo, Tom Tak-Lam Chan, Huu-Thanh Nguyen, Daniel Pak-Kong Lun
Format: Article
Language:English
Published: Wiley 2023-12-01
Series:Advanced Intelligent Systems
Subjects:
Online Access:https://doi.org/10.1002/aisy.202300364
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author Sik-Ho Tsang
Zhaoqing Suo
Tom Tak-Lam Chan
Huu-Thanh Nguyen
Daniel Pak-Kong Lun
author_facet Sik-Ho Tsang
Zhaoqing Suo
Tom Tak-Lam Chan
Huu-Thanh Nguyen
Daniel Pak-Kong Lun
author_sort Sik-Ho Tsang
collection DOAJ
description To increase the reliability of the printed circuit board (PCB) manufacturing process, automated optical inspection is often employed for soldering defect detection. However, traditional approaches built on handcrafted features, predefined rules, or thresholds are often susceptible to the variation of the acquired images’ quality and give unstable performances. To solve this problem, a deep learning‐based soldering defect detection method is developed in this article. Like many real‐life deep learning applications, the number of available training samples is often limited. This creates a challenging low‐data scenario, as deep learning typically requires massive data to perform well. To address this issue, a multitask learning model is proposed, namely, PCBMTL, that can simultaneously learn the classification and segmentation tasks under low‐data regimes. By acquiring the segmentation knowledge, classification performance is substantially improved with few samples. To facilitate the study, a soldering defect image dataset, namely, PCBSPDefect, is built. It focuses on the dual in‐line packages (DIP) at the PCB back side, DIP at the PCB front side, and flat flexible cables. Experimental results show that the proposed PCBMTL outperforms the best existing approaches by over 5–17% of average accuracy for different datasets.
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spelling doaj.art-ec980cde730b435f808567ccf9a67f562023-12-23T04:53:50ZengWileyAdvanced Intelligent Systems2640-45672023-12-01512n/an/a10.1002/aisy.202300364PCB Soldering Defect Inspection Using Multitask Learning under Low Data RegimesSik-Ho Tsang0Zhaoqing Suo1Tom Tak-Lam Chan2Huu-Thanh Nguyen3Daniel Pak-Kong Lun4Unit 1212-1213 Hong Kong Science Park 12/F, Building 19W, Pak Shek Kok, NT Hong Kong ChinaUnit 1212-1213 Hong Kong Science Park 12/F, Building 19W, Pak Shek Kok, NT Hong Kong ChinaUnit 1212-1213 Hong Kong Science Park 12/F, Building 19W, Pak Shek Kok, NT Hong Kong ChinaUnit 1212-1213 Hong Kong Science Park 12/F, Building 19W, Pak Shek Kok, NT Hong Kong ChinaUnit 1212-1213 Hong Kong Science Park 12/F, Building 19W, Pak Shek Kok, NT Hong Kong ChinaTo increase the reliability of the printed circuit board (PCB) manufacturing process, automated optical inspection is often employed for soldering defect detection. However, traditional approaches built on handcrafted features, predefined rules, or thresholds are often susceptible to the variation of the acquired images’ quality and give unstable performances. To solve this problem, a deep learning‐based soldering defect detection method is developed in this article. Like many real‐life deep learning applications, the number of available training samples is often limited. This creates a challenging low‐data scenario, as deep learning typically requires massive data to perform well. To address this issue, a multitask learning model is proposed, namely, PCBMTL, that can simultaneously learn the classification and segmentation tasks under low‐data regimes. By acquiring the segmentation knowledge, classification performance is substantially improved with few samples. To facilitate the study, a soldering defect image dataset, namely, PCBSPDefect, is built. It focuses on the dual in‐line packages (DIP) at the PCB back side, DIP at the PCB front side, and flat flexible cables. Experimental results show that the proposed PCBMTL outperforms the best existing approaches by over 5–17% of average accuracy for different datasets.https://doi.org/10.1002/aisy.202300364automated optical inspectiondeep neural networksmultitask learningprinted circuit boardssoldering defect detection
spellingShingle Sik-Ho Tsang
Zhaoqing Suo
Tom Tak-Lam Chan
Huu-Thanh Nguyen
Daniel Pak-Kong Lun
PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes
Advanced Intelligent Systems
automated optical inspection
deep neural networks
multitask learning
printed circuit boards
soldering defect detection
title PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes
title_full PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes
title_fullStr PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes
title_full_unstemmed PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes
title_short PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes
title_sort pcb soldering defect inspection using multitask learning under low data regimes
topic automated optical inspection
deep neural networks
multitask learning
printed circuit boards
soldering defect detection
url https://doi.org/10.1002/aisy.202300364
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AT huuthanhnguyen pcbsolderingdefectinspectionusingmultitasklearningunderlowdataregimes
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